Three Dimensional Molded Interconnect Devices 3D MID

Three Dimensional Molded Interconnect Devices  3D MID
Author: Jörg Franke
Publsiher: Carl Hanser Verlag GmbH Co KG
Total Pages: 368
Release: 2014-04-03
ISBN 10: 1569905525
ISBN 13: 9781569905524
Language: EN, FR, DE, ES & NL

Three Dimensional Molded Interconnect Devices 3D MID Book Review:

Three-dimensional molded interconnect devices (MIDs) enable mechanical, electronic, optical, thermal and fluidic functions to be integrated into injection-molded components. Function integration on this scale goes hand in hand with a high level of geometrical design freedom and opportunities for miniaturization, plus the associated reduction in weight and savings on product costs. MIDs are made primarily of recyclable thermoplastics, so they are more environmentally compatible than alternatives produced using other available technologies. MIDs are used in virtually every sector of electronics. The many standard applications for MIDs in the automotive industry in particular also drive for further development and research into MID technology. The significance of MID technology is also increasing in medical engineering, IT and telecommunications and in industrial automation, with numerous applications now successfully implemented in all these various fields. This book offers a comprehensive insight into the state of the art in 3D-MID technology along the entire process chain. Individual chapters, moreover, deal with systematics of targeted development of MID parts and explore, with a dozen and more successful series-production applications as examples, the widely diverse fields of application for MID technology.

Three dimensional Molded Interconnect Devices 3D MID

Three dimensional Molded Interconnect Devices  3D MID
Author: Jörg Franke (Dipl.-Ing.)
Publsiher: Unknown
Total Pages: 356
Release: 2014
ISBN 10: 9781680157277
ISBN 13: 1680157272
Language: EN, FR, DE, ES & NL

Three dimensional Molded Interconnect Devices 3D MID Book Review:

Application of In mold Decoration of Injection Molding in Three Dimensional Molded Interconnect Devices

Application of In mold Decoration of Injection Molding in Three Dimensional Molded Interconnect Devices
Author: Anonim
Publsiher: Unknown
Total Pages: 181
Release: 2014
ISBN 10:
ISBN 13: OCLC:940882376
Language: EN, FR, DE, ES & NL

Application of In mold Decoration of Injection Molding in Three Dimensional Molded Interconnect Devices Book Review:

Proceedings of the 6th CIRP Sponsored International Conference on Digital Enterprise Technology

Proceedings of the 6th CIRP Sponsored International Conference on Digital Enterprise Technology
Author: George Q. Huang,K.L. Mak,Paul G. Maropoulos
Publsiher: Springer Science & Business Media
Total Pages: 1803
Release: 2009-12-12
ISBN 10: 9783642104305
ISBN 13: 3642104304
Language: EN, FR, DE, ES & NL

Proceedings of the 6th CIRP Sponsored International Conference on Digital Enterprise Technology Book Review:

This Proceedings volume contains articles presented at the CIRP-Sponsored Inter- tional Conference on Digital Enterprise Technology (DET2009) that takes place December 14–16, 2009 in Hong Kong. This is the 6th DET conference in the series and the first to be held in Asia. Professor Paul Maropoulos initiated, hosted and chaired the 1st International DET Conference held in 2002 at the University of D- ham. Since this inaugural first DET conference, DET conference series has been s- cessfully held in 2004 at Seattle, Washington USA, in 2006 at Setubal Portugal, in 2007 at Bath England, and in 2008 at Nantes France. The DET2009 conference continues to bring together International expertise from the academic and industrial fields, pushing forward the boundaries of research kno- edge and best practice in digital enterprise technology for design and manufacturing, and logistics and supply chain management. Over 120 papers from over 10 countries have been accepted for presentation at DET2009 and inclusion in this Proceedings volume after stringent refereeing process. On behalf of the organizing and program committees, the Editors are grateful to the many people who have made DET2009 possible: to the authors and presenters, es- cially the keynote speakers, to those who have diligently reviewed submissions, to members of International Scientific Committee, Organizing Committee and Advisory Committes, and to colleagues for their hard work in sorting out all the arrangements. We would also like to extend our gratitude to DET2009 sponsors, co-organizers, and supporting organizations.

Polymers in Organic Electronics

Polymers in Organic Electronics
Author: Sulaiman Khalifeh
Publsiher: Elsevier
Total Pages: 616
Release: 2020-04-01
ISBN 10: 192788568X
ISBN 13: 9781927885680
Language: EN, FR, DE, ES & NL

Polymers in Organic Electronics Book Review:

Polymers in Organic Electronics: Polymer Selection for Electronic, Mechatronic, and Optoelectronic Systems provides readers with vital data, guidelines, and techniques for optimally designing organic electronic systems using novel polymers. The book classifies polymer families, types, complexes, composites, nanocomposites, compounds, and small molecules while also providing an introduction to the fundamental principles of polymers and electronics. Features information on concepts and optimized types of electronics and a classification system of electronic polymers, including piezoelectric and pyroelectric, optoelectronic, mechatronic, organic electronic complexes, and more. The book is designed to help readers select the optimized material for structuring their organic electronic system. Chapters discuss the most common properties of electronic polymers, methods of optimization, and polymeric-structured printed circuit boards. The polymeric structures of optoelectronics and photonics are covered and the book concludes with a chapter emphasizing the importance of polymeric structures for packaging of electronic devices. Provides key identifying details on a range of polymers, micro-polymers, nano-polymers, resins, hydrocarbons, and oligomers Covers the most common electrical, electronic, and optical properties of electronic polymers Describes the underlying theories on the mechanics of polymer conductivity Discusses polymeric structured printed circuit boards, including their rapid prototyping and optimizing their polymeric structures Shows optimization methods for both polymeric structures of organic active electronic components and organic passive electronic components

Polymers in Electronics 2007

Polymers in Electronics 2007
Author: Anonim
Publsiher: iSmithers Rapra Publishing
Total Pages: 208
Release: 2007
ISBN 10: 9781847350091
ISBN 13: 1847350097
Language: EN, FR, DE, ES & NL

Polymers in Electronics 2007 Book Review:

This conference saw presentations from all parts of the electronics industry's materials supply chain, from raw materials to finished products and offered an opportunity to learn more about both traditional and new polymer materials, their markets, manufacturing processes and applications. It also covered the impact of legislation, the need to recycle and other polymer related challenges and opportunities for the industry.

Micro Manufacturing Technologies and Their Applications

Micro Manufacturing Technologies and Their Applications
Author: Irene Fassi,David Shipley
Publsiher: Springer
Total Pages: 296
Release: 2017-01-31
ISBN 10: 331939651X
ISBN 13: 9783319396514
Language: EN, FR, DE, ES & NL

Micro Manufacturing Technologies and Their Applications Book Review:

This book provides in-depth theoretical and practical information on recent advances in micro-manufacturing technologies and processes, covering such topics as micro-injection moulding, micro-cutting, micro-EDM, micro-assembly, micro-additive manufacturing, moulded interconnected devices, and microscale metrology. It is designed to provide complementary material for the related e-learning platform on micro-manufacturing developed within the framework of the Leonardo da Vinci project 2013-3748/542424: MIMAN-T: Micro-Manufacturing Training System for SMEs. The book is mainly addressed to technicians and prospective professionals in the sector and will serve as an easily usable tool to facilitate the translation of micro-manufacturing technologies into tangible industrial benefits. Numerous examples are included to assist readers in learning and implementing the described technologies. In addition, an individual chapter is devoted to technological foresight, addressing market analysis and business models for micro-manufacturers.

Microengineering of Metals and Ceramics Part I

Microengineering of Metals and Ceramics  Part I
Author: Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt
Publsiher: John Wiley & Sons
Total Pages: 392
Release: 2008-09-26
ISBN 10: 3527616942
ISBN 13: 9783527616947
Language: EN, FR, DE, ES & NL

Microengineering of Metals and Ceramics Part I Book Review:

Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. In this volume, authors from three major competence centres for microengineering illustrate step by step the process from designing and simulating microcomponents of metallic and ceramic materials to replicating micro-scale components by injection molding.

Microengineering of Metals and Ceramics

Microengineering of Metals and Ceramics
Author: Henry Baltes,Oliver Brand,Gary K. Fedder,Christofer Hierold,Jan G. Korvink,Osamu Tabata,Detlef Löhe,Jürgen Hausselt
Publsiher: John Wiley & Sons
Total Pages: 306
Release: 2008-09-26
ISBN 10: 3527616950
ISBN 13: 9783527616954
Language: EN, FR, DE, ES & NL

Microengineering of Metals and Ceramics Book Review:

Microstructures, electronics, nanotechnology - these vast fields of research are growing together as the size gap narrows and many different materials are combined. Current research, engineering sucesses and newly commercialized products hint at the immense innovative potentials and future applications that open up once mankind controls shape and function from the atomic level right up to the visible world without any gaps. Continuing from the previous volume, authors from three major competence centres for microengineering here cover all aspects of specialized replication techniques and how to employ state-of-the-art technologies for testing and characterizing micro-scale components, and illustrate quality control aspects and strategies for automation of production procedures in view of future industrial production and commercialisation.

Digital Enterprise Technology

Digital Enterprise Technology
Author: Pedro Filipe Cunha,Paul G. Maropoulos
Publsiher: Springer Science & Business Media
Total Pages: 593
Release: 2007-09-18
ISBN 10: 0387498648
ISBN 13: 9780387498645
Language: EN, FR, DE, ES & NL

Digital Enterprise Technology Book Review:

The first Digital Enterprise Technology (DET) International Conference was held in Durham, UK in 2002 and the second DET Conference in Seattle, USA in 2004. Sponsored by CIRP (College International pour la Recherche en Productique), the third DET Conference took place in Setúbal, Portugal in 2006. Digital Enterprise Technology: Perspectives and Future Challenges is an edited volume based on this conference. Topics include: distributed and collaborative design, process modeling and process planning, advanced factory equipment and layout design and modeling, physical-to-digital environment integrators, enterprise integration technologies, and entrepreneurship in DET.

Reflow Soldering

Reflow Soldering
Author: Balázs Illés,Oliver Krammer,Attila Geczy
Publsiher: Elsevier
Total Pages: 294
Release: 2020-07-02
ISBN 10: 0128185066
ISBN 13: 9780128185063
Language: EN, FR, DE, ES & NL

Reflow Soldering Book Review:

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology

Handbook of Industrial Inkjet Printing

Handbook of Industrial Inkjet Printing
Author: Werner Zapka
Publsiher: John Wiley & Sons
Total Pages: 984
Release: 2018-01-11
ISBN 10: 3527338322
ISBN 13: 9783527338320
Language: EN, FR, DE, ES & NL

Handbook of Industrial Inkjet Printing Book Review:

Unique in its integration of individual topics to achieve a full-system approach, this book addresses all the aspects essential for industrial inkjet printing. After an introduction listing the industrial printing techniques available, the text goes on to discuss individual topics, such as ink, printheads and substrates, followed by metrology techniques that are required for reliable systems. Three iteration cycles are then described, including the adaptation of the ink to the printhead, the optimization of the ink to the substrate and the integration of machine manufacturing, monitoring, and data handling, among others. Finally, the book summarizes a number of case studies and success stories from selected areas, including graphics, printed electronics, and 3D printing as well a list of ink suppliers, printhead manufacturers and integrators. Practical hints are included throughout for a direct hands-on experience. Invaluable for industrial users and academics, whether ink developers or mechanical engineers, and working in areas ranging from metrology to intellectual property.

4M 2006 Second International Conference on Multi Material Micro Manufacture

4M 2006   Second International Conference on Multi Material Micro Manufacture
Author: Stefan Dimov,Wolfgang Menz,Bertrand Fillon
Publsiher: Elsevier
Total Pages: 448
Release: 2006-09-15
ISBN 10: 9780080466293
ISBN 13: 008046629X
Language: EN, FR, DE, ES & NL

4M 2006 Second International Conference on Multi Material Micro Manufacture Book Review:

4M 2006 - Second International Conference on Multi-Material Micro Manufacture covers the latest state-of-the-art research results from leading European researchers in advanced micro technologies for batch processing of metals, polymers, and ceramics, and the development of new production platforms for micro systems-based products. These contributions are from leading authors at a platform endorsed and funded by the European Union R&D community, as well as leading universities, and independent research and corporate organizations. Contains authoritative papers that reflect the latest developments in micro technologies and micro systems-based products

Theory and Phenomena of Metamaterials

Theory and Phenomena of Metamaterials
Author: Filippo Capolino
Publsiher: CRC Press
Total Pages: 974
Release: 2017-12-19
ISBN 10: 1351835262
ISBN 13: 9781351835268
Language: EN, FR, DE, ES & NL

Theory and Phenomena of Metamaterials Book Review:

Theory and Phenomena of Metamaterials offers an in-depth look at the theoretical background and basic properties of electromagnetic artificial materials, often called metamaterials. A volume in the Metamaterials Handbook, this book provides a comprehensive guide to working with metamaterials using topics presented in a concise review format along with numerous references. With contributions from leading researchers, this text covers all areas where artificial materials have been developed. Each chapter in the text features a concluding summary as well as various cross references to address a wide range of disciplines in a single volume.

Cyber Physical and Gentelligent Systems in Manufacturing and Life Cycle

Cyber Physical and Gentelligent Systems in Manufacturing and Life Cycle
Author: Berend Denkena,Tobias Morke
Publsiher: Academic Press
Total Pages: 492
Release: 2017-06-07
ISBN 10: 0128126000
ISBN 13: 9780128126004
Language: EN, FR, DE, ES & NL

Cyber Physical and Gentelligent Systems in Manufacturing and Life Cycle Book Review:

Cyber-Physical and Gentelligent Systems in Manufacturing and Life Cycle explores the latest technologies resulting from the integration of sensing components throughout the production supply chain, and the resulting possibilities to improve efficiency, flexibility, and product quality. The authors present cutting edge research into data storage in components, communication devices, data acquisition, as well as new industrial applications. Detailed technical descriptions of the tools are presented in addition to discussions of how these systems have been used, the benefits they provide, and what industry problems they could tackle in the future. This is essential reading for researchers and production engineers interested in the potential of cyber physical systems to optimize all parts of the supply chain. Addresses applications of cyber physical systems throughout the product lifecycle, including design, manufacture, and maintenance Features five industry case studies examining tools in different stages of the production chain Provides an invaluable recap of 12 years of advances in digitization of production processes and the implementation of intelligent systems Explores how these technologies could be used to solve problems in the future

Smart Technologies for Precision Assembly

Smart Technologies for Precision Assembly
Author: Svetan Ratchev
Publsiher: Springer Nature
Total Pages: 370
Release: 2021
ISBN 10: 3030726320
ISBN 13: 9783030726324
Language: EN, FR, DE, ES & NL

Smart Technologies for Precision Assembly Book Review:

This open access book constitutes the refereed post-conference proceedings of the 9th IFIP WG 5.5 International Precision Assembly Seminar, IPAS 2020, held virtually in December 2020. The 16 revised full papers and 10 revised short papers presented together with 1 keynote paper were carefully reviewed and selected from numerous submissions. The papers address topics such as assembly design and planning; assembly operations; assembly cells and systems; human centred assembly; and assistance methods in assembly.

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Haleh Ardebili,Jiawei Zhang,Michael Pecht
Publsiher: William Andrew
Total Pages: 508
Release: 2018-10-23
ISBN 10: 0128119799
ISBN 13: 9780128119792
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Concurrent Engineering Approaches for Sustainable Product Development in a Multi Disciplinary Environment

Concurrent Engineering Approaches for Sustainable Product Development in a Multi Disciplinary Environment
Author: Josip Stjepandić,Georg Rock,Cees Bil
Publsiher: Springer Science & Business Media
Total Pages: 1217
Release: 2012-08-10
ISBN 10: 1447144260
ISBN 13: 9781447144267
Language: EN, FR, DE, ES & NL

Concurrent Engineering Approaches for Sustainable Product Development in a Multi Disciplinary Environment Book Review:

The CE Conference series is organized annually by the International Society for Productivity Enhancement (ISPE) and constitutes an important forum for international scientific exchange on concurrent and collaborative enterprise engineering. These international conferences attract a significant number of researchers, industrialists and students, as well as government representatives, who are interested in the recent advances in concurrent engineering research and applications. Concurrent Engineering Approaches for Sustainable Product Development in a Multi-Disciplinary Environment: Proceedings of the 19th ISPE International Conference on Concurrent Engineering contains papers accepted, peer reviewed and presented at the annual conference held at the University of Applied Sciences in Trier, Germany, from 3rd-7th of September 2012. This covers a wide range of cutting-edge topics including: Systems Engineering and Innovation Design for Sustainability Knowledge Engineering and Management Managing product variety Product Life-Cycle Management and Service Engineering Value Engineering

Search of Excellence ANTEC 91

Search of Excellence  ANTEC 91
Author: Society of Plastic Engineers
Publsiher: CRC Press
Total Pages: 2720
Release: 1991-05-01
ISBN 10: 9780877628446
ISBN 13: 0877628440
Language: EN, FR, DE, ES & NL

Search of Excellence ANTEC 91 Book Review:

Plastics for Electronics

Plastics for Electronics
Author: M. Goosey
Publsiher: Springer Science & Business Media
Total Pages: 404
Release: 2013-04-17
ISBN 10: 9401727007
ISBN 13: 9789401727006
Language: EN, FR, DE, ES & NL

Plastics for Electronics Book Review:

Polymeric materials are widely used during nearly all stages of the manufacturing process of electronics products and this book is intended to give an introductory overview of the chemistry, properties and uses of some of the more important classes of materials likely to be encountered in these applications. It is intended to serve primarily as an introduction to the use of polymers and plastics in the processing and manufacture of electronic and electrical components and assemblies. With no in-depth knowledge of polymers assumed, the book is ideal for engineers and researchers working in areas where electronics and polymer technology overlap. There are also numerous references for those wishing to delve deeper. The first edition of this book was published in 1985 and since then there has been an unbelievable change and growth in the electronics industry. Much of this has been made possible by the continued development of new and improved polymeric materials. In some areas the polymers used have changed markedly whereas in others there have been continued improvements to the same basic materials. Consequently, this second edition includes new chapters detailing the materials which have emerged more recently. Chapters covering the same topics as the original version have been extensively rewritten and updated, often with the assistance of current international experts. In the last few years much work has been carried out on the development and use of special polymers that have important properties in addition to those normally associated with conventional polymers. This edition therefore includes a chapter that introduces one particular group of materials exhibiting these special properties, the ferroelectric polymers. The book also includes new chapters on high temperature thermoplastics, or engineering plastics as they are sometimes known, and their use in so-called moulded interconnect devices, where the polymer is used to provide a much wider range of functions than has been possible using a more conventional approach. This new edition also has a wider international coverage with chapters by experts based in Belgium, Holland, Switzerland, Germany, England and the United States of America.