Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture
Author: E-H Wong,Y.-W. Mai
Publsiher: Woodhead Publishing
Total Pages: 482
Release: 2015-05-23
ISBN 10: 0857099116
ISBN 13: 9780857099112
Language: EN, FR, DE, ES & NL

Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture Book Review:

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Cyber Physical Systems Design and Application for Industry 4 0

Cyber Physical Systems  Design and Application for Industry 4 0
Author: Alla G. Kravets
Publsiher: Springer Nature
Total Pages: 329
Release: 2021
ISBN 10: 3030660818
ISBN 13: 9783030660819
Language: EN, FR, DE, ES & NL

Cyber Physical Systems Design and Application for Industry 4 0 Book Review:

Proceedings of the International Symposium on Microelectronics

Proceedings of the     International Symposium on Microelectronics
Author: Anonim
Publsiher: Unknown
Total Pages: 329
Release: 1999
ISBN 10:
ISBN 13: UOM:39015048208287
Language: EN, FR, DE, ES & NL

Proceedings of the International Symposium on Microelectronics Book Review:

Proceedings 1998 International Symposium on Microelectronics

Proceedings 1998 International Symposium on Microelectronics
Author: Anonim
Publsiher: Society of Photo Optical
Total Pages: 1046
Release: 1998
ISBN 10:
ISBN 13: CORNELL:31924084619760
Language: EN, FR, DE, ES & NL

Proceedings 1998 International Symposium on Microelectronics Book Review:

Proceedings 1999 International Symposium on Microelectronics

Proceedings 1999 International Symposium on Microelectronics
Author: Dick Gehman,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers
Publsiher: Unknown
Total Pages: 806
Release: 1999
ISBN 10:
ISBN 13: UCSD:31822025767401
Language: EN, FR, DE, ES & NL

Proceedings 1999 International Symposium on Microelectronics Book Review:

Robust Reliability in the Mechanical Sciences

Robust Reliability in the Mechanical Sciences
Author: Yakov Ben-Haim
Publsiher: Springer Science & Business Media
Total Pages: 233
Release: 2012-12-06
ISBN 10: 3642611540
ISBN 13: 9783642611544
Language: EN, FR, DE, ES & NL

Robust Reliability in the Mechanical Sciences Book Review:

The aim of the book is to develop methodology for reliablity analysis which is particularly suited to the types of partial information characteristic of mechanical systems and structures. The book is designed as an upper-level undergraduate or first-year graduate text on robust reliability of mechanical systems. It will give the student or engineer a working knowledge of robust reliability which will enable him to analyse the reliability of mechanical systems. Each chapter is introduced with a brief conceptual survey of the main ideas, which are then developed through examples. Problems at the end of each chapter give the student the opportunity to strengthen and extend his or her understanding.

Mechanics of Microelectronics

Mechanics of Microelectronics
Author: G.Q. Zhang,W.D. van Driel,X.J. Fan
Publsiher: Springer Science & Business Media
Total Pages: 566
Release: 2006-08-25
ISBN 10: 1402049358
ISBN 13: 9781402049354
Language: EN, FR, DE, ES & NL

Mechanics of Microelectronics Book Review:

This book is written by leading experts with both profound knowledge and rich practical experience in advanced mechanics and the microelectronics industry essential for current and future development. It aims to provide the cutting edge knowledge and solutions for various mechanical related problems, in a systematic way. It contains important and detailed information about the state-of-the-art theories, methodologies, the way of working and real case studies.

System Reliability

System Reliability
Author: Constantin Volosencu
Publsiher: BoD – Books on Demand
Total Pages: 396
Release: 2017-12-20
ISBN 10: 9535137050
ISBN 13: 9789535137054
Language: EN, FR, DE, ES & NL

System Reliability Book Review:

Researchers from the entire world write to figure out their newest results and to contribute new ideas or ways in the field of system reliability and maintenance. Their articles are grouped into four sections: reliability, reliability of electronic devices, power system reliability and feasibility and maintenance. The book is a valuable tool for professors, students and professionals, with its presentation of issues that may be taken as examples applicable to practical situations. Some examples defining the contents can be highlighted: system reliability analysis based on goal-oriented methodology; reliability design of water-dispensing systems; reliability evaluation of drivetrains for off-highway machines; extending the useful life of asset; network reliability for faster feasibility decision; analysis of standard reliability parameters of technical systems' parts; cannibalisation for improving system reliability; mathematical study on the multiple temperature operational life testing procedure, for electronic industry; reliability prediction of smart maximum power point converter in photovoltaic applications; reliability of die interconnections used in plastic discrete power packages; the effects of mechanical and electrical straining on performances of conventional thick-film resistors; software and hardware development in the electric power system; electric interruptions and loss of supply in power systems; feasibility of autonomous hybrid AC/DC microgrid system; predictive modelling of emergency services in electric power distribution systems; web-based decision-support system in the electric power distribution system; preventive maintenance of a repairable equipment operating in severe environment; and others.

Advances in Micro Nano Electromechanical Systems and Fabrication Technologies

Advances in Micro Nano Electromechanical Systems and Fabrication Technologies
Author: Kenichi Takahata
Publsiher: BoD – Books on Demand
Total Pages: 236
Release: 2013-05-29
ISBN 10: 9535110853
ISBN 13: 9789535110859
Language: EN, FR, DE, ES & NL

Advances in Micro Nano Electromechanical Systems and Fabrication Technologies Book Review:

MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.

Die Attach Materials for High Temperature Applications in Microelectronics Packaging

Die Attach Materials for High Temperature Applications in Microelectronics Packaging
Author: Kim S. Siow
Publsiher: Springer
Total Pages: 279
Release: 2019-01-29
ISBN 10: 3319992562
ISBN 13: 9783319992563
Language: EN, FR, DE, ES & NL

Die Attach Materials for High Temperature Applications in Microelectronics Packaging Book Review:

This book presents the scientific principles, processing conditions, probable failure mechanisms, and a description of reliability performance and equipment required for implementing high-temperature and lead-free die attach materials. In particular, it addresses the use of solder alloys, silver and copper sintering, and transient liquid-phase sintering. While different solder alloys have been used widely in the microelectronics industry, the implementation of sintering silver and transient liquid-phase sintering remains limited to a handful of companies. Hence, the book devotes many chapters to sintering technologies, while simultaneously providing only a cursory coverage of the more widespread techniques employing solder alloys. Addresses the differences between sintering and soldering (the current die-attach technologies), thereby comprehensively addressing principles, methods, and performance of these high-temperature die-attach materials; Emphasizes the industrial perspective, with chapters written by engineers who have hands-on experience using these technologies; Baker Hughes, Bosch and ON Semiconductor, are represented as well as materials suppliers such as Indium; Simultaneously provides the detailed science underlying these technologies by leading academic researchers in the field.

Solder Joint Reliability

Solder Joint Reliability
Author: John H. Lau
Publsiher: Springer Science & Business Media
Total Pages: 631
Release: 2013-11-27
ISBN 10: 1461539102
ISBN 13: 9781461539100
Language: EN, FR, DE, ES & NL

Solder Joint Reliability Book Review:

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Orbital Mechanics for Engineering Students

Orbital Mechanics for Engineering Students
Author: Howard D Curtis
Publsiher: Elsevier
Total Pages: 744
Release: 2009-10-26
ISBN 10: 0080887848
ISBN 13: 9780080887845
Language: EN, FR, DE, ES & NL

Orbital Mechanics for Engineering Students Book Review:

Orbital Mechanics for Engineering Students, Second Edition, provides an introduction to the basic concepts of space mechanics. These include vector kinematics in three dimensions; Newton’s laws of motion and gravitation; relative motion; the vector-based solution of the classical two-body problem; derivation of Kepler’s equations; orbits in three dimensions; preliminary orbit determination; and orbital maneuvers. The book also covers relative motion and the two-impulse rendezvous problem; interplanetary mission design using patched conics; rigid-body dynamics used to characterize the attitude of a space vehicle; satellite attitude dynamics; and the characteristics and design of multi-stage launch vehicles. Each chapter begins with an outline of key concepts and concludes with problems that are based on the material covered. This text is written for undergraduates who are studying orbital mechanics for the first time and have completed courses in physics, dynamics, and mathematics, including differential equations and applied linear algebra. Graduate students, researchers, and experienced practitioners will also find useful review materials in the book. NEW: Reorganized and improved discusions of coordinate systems, new discussion on perturbations and quarternions NEW: Increased coverage of attitude dynamics, including new Matlab algorithms and examples in chapter 10 New examples and homework problems

Plastic Packaging of Microelectronic Devices

Plastic Packaging of Microelectronic Devices
Author: Louis T. Manzione
Publsiher: Van Nostrand Reinhold Company
Total Pages: 377
Release: 1990
ISBN 10:
ISBN 13: UOM:39015019554610
Language: EN, FR, DE, ES & NL

Plastic Packaging of Microelectronic Devices Book Review:

Reliability Yield and Stress Burn In

Reliability  Yield  and Stress Burn In
Author: Way Kuo,Wei-Ting Kary Chien,Taeho Kim
Publsiher: Springer Science & Business Media
Total Pages: 394
Release: 2013-11-27
ISBN 10: 1461556716
ISBN 13: 9781461556718
Language: EN, FR, DE, ES & NL

Reliability Yield and Stress Burn In Book Review:

The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: • the economic impact of employing the microelectronics fabricated by in dustry, • a study of the relationship between reliability and yield, • the progression toward miniaturization and higher reliability, and • the correctness and complexity of new system designs, which include a very significant portion of software.

High Temperature Electronics

High Temperature Electronics
Author: F. Patrick McCluskey,Thomas Podlesak,Richard Grzybowski
Publsiher: CRC Press
Total Pages: 352
Release: 2018-05-04
ISBN 10: 1351440810
ISBN 13: 9781351440813
Language: EN, FR, DE, ES & NL

High Temperature Electronics Book Review:

The development of electronics that can operate at high temperatures has been identified as a critical technology for the next century. Increasingly, engineers will be called upon to design avionics, automotive, and geophysical electronic systems requiring components and packaging reliable to 200 °C and beyond. Until now, however, they have had no single resource on high temperature electronics to assist them. Such a resource is critically needed, since the design and manufacture of electronic components have now made it possible to design electronic systems that will operate reliably above the traditional temperature limit of 125 °C. However, successful system development efforts hinge on a firm understanding of the fundamentals of semiconductor physics and device processing, materials selection, package design, and thermal management, together with a knowledge of the intended application environments. High Temperature Electronics brings together this essential information and presents it for the first time in a unified way. Packaging and device engineers and technologists will find this book required reading for its coverage of the techniques and tradeoffs involved in materials selection, design, and thermal management and for its presentation of best design practices using actual fielded systems as examples. In addition, professors and students will find this book suitable for graduate-level courses because of its detailed level of explanation and its coverage of fundamental scientific concepts. Experts from the field of high temperature electronics have contributed to nine chapters covering topics ranging from semiconductor device selection to testing and final assembly.

1997 International Symposium on Microelectronics

1997 International Symposium on Microelectronics
Author: Anonim
Publsiher: Society of Photo Optical
Total Pages: 707
Release: 1997
ISBN 10:
ISBN 13: CORNELL:31924081323697
Language: EN, FR, DE, ES & NL

1997 International Symposium on Microelectronics Book Review:

Contains the proceedings of IMAPS '97 in Adobe portable document format (PDF).

Materials for Advanced Packaging

Materials for Advanced Packaging
Author: Daniel Lu,C.P. Wong
Publsiher: Springer
Total Pages: 969
Release: 2016-11-18
ISBN 10: 3319450980
ISBN 13: 9783319450988
Language: EN, FR, DE, ES & NL

Materials for Advanced Packaging Book Review:

Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. The book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging.

Printed Circuit Boards

Printed Circuit Boards
Author: R. S. Khandpur
Publsiher: Tata McGraw-Hill Education
Total Pages: 691
Release: 2005
ISBN 10: 0070588147
ISBN 13: 9780070588141
Language: EN, FR, DE, ES & NL

Printed Circuit Boards Book Review:

This domain derives from such diverse disciplines as electronics, mechanical engineering, fluid dynamics, thermodynamics, chemistry, physics, metallurgy and optics. The author, with nearly four decades of experience in R&D, technology development, and education and training, provides a practical and hand-on approach to the subject, by covering the latest technological developments and covering all the vital aspects of PCB, i.e. design, fabrication, assembly, testing, including reliability and quality.With this coverage, the book will be useful to designers, manufacturers, and students of electrical and electronic engineering.

Automotive Engineering

Automotive Engineering
Author: Anonim
Publsiher: Unknown
Total Pages: 329
Release: 1994
ISBN 10:
ISBN 13: UCSD:31822020420360
Language: EN, FR, DE, ES & NL

Automotive Engineering Book Review:

Semiconductor Packaging

Semiconductor Packaging
Author: Andrea Chen,Randy Hsiao-Yu Lo
Publsiher: CRC Press
Total Pages: 216
Release: 2016-04-19
ISBN 10: 1439862079
ISBN 13: 9781439862070
Language: EN, FR, DE, ES & NL

Semiconductor Packaging Book Review:

In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. By tying together the disparate elements essential to a semiconductor package, the authors show how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world. The text also covers packaging materials for MEMS, solar technology, and LEDs and explores future trends in semiconductor packages.