Reflow Soldering Processes

Reflow Soldering Processes
Author: Ning-Cheng Lee
Publsiher: Elsevier
Total Pages: 288
Release: 2002-01-24
ISBN 10: 008049224X
ISBN 13: 9780080492247
Language: EN, FR, DE, ES & NL

Reflow Soldering Processes Book Review:

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Reflow Soldering Processes and Troubleshooting

Reflow Soldering Processes and Troubleshooting
Author: Ning-Cheng Lee
Publsiher: Newnes
Total Pages: 270
Release: 2002-01
ISBN 10: 0750672188
ISBN 13: 9780750672184
Language: EN, FR, DE, ES & NL

Reflow Soldering Processes and Troubleshooting Book Review:

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Reflow Soldering

Reflow Soldering
Author: Balázs Illés,Oliver Krammer,Attila Geczy
Publsiher: Elsevier
Total Pages: 294
Release: 2020-07-02
ISBN 10: 0128185066
ISBN 13: 9780128185063
Language: EN, FR, DE, ES & NL

Reflow Soldering Book Review:

Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special reflow ovens. Each of these chapters includes a discussion of the physical background, structure and working principle, and characterization of the heating, flow and vapor parameters; and concludes with a review of the application of the techniques and typical solder failures. The book concludes with a discussion of the various numerical simulations of the different ovens. This book will be useful for researchers and process and quality and research and design engineers within the electronics and manufacturing industries. Provides an overview and comparison of the existing reflow apparatus, heating methods, and working principles Analyses and compares the different reflow ovens Discusses useful tools such as characterization and measurement methods and includes numerical case studies to assist in solving soldering problems and improve soldering quality Introduces Vapor Phase Soldering (VPS) technology

Soldering Processes and Equipment

Soldering Processes and Equipment
Author: Michael Pecht
Publsiher: John Wiley & Sons
Total Pages: 312
Release: 1993-08-30
ISBN 10: 9780471591672
ISBN 13: 047159167X
Language: EN, FR, DE, ES & NL

Soldering Processes and Equipment Book Review:

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and quality control during the manufacturing process and emphasizes the importance of rework in the soldering industry.

Soldering Handbook For Printed Circuits and Surface Mounting

Soldering Handbook For Printed Circuits and Surface Mounting
Author: Howard H. Manko
Publsiher: Springer Science & Business Media
Total Pages: 523
Release: 1995-10-31
ISBN 10: 9780442012069
ISBN 13: 0442012063
Language: EN, FR, DE, ES & NL

Soldering Handbook For Printed Circuits and Surface Mounting Book Review:

Soldering Handbook for Printed Circuits and Surface Mounting, Second Edition, covers every aspect of this packaging technology, and contains the latest information on design, presolder operations, materials, equipment, surface mount technology, cleaning, quality and inspection, touch-up and repair, process economy, line management, and more.

Principles of Reliable Soldering Techniques

Principles of Reliable Soldering Techniques
Author: R. Sengupta
Publsiher: New Age International
Total Pages: 116
Release: 1997
ISBN 10: 9788122411096
ISBN 13: 8122411096
Language: EN, FR, DE, ES & NL

Principles of Reliable Soldering Techniques Book Review:

Soldering, Though Being An Age Old Phenomenon, Is Still Perhaps A Difficult Subject To Understand, Due To Its Interdisciplinary Nature. In This Book, Efforts Have Been Made To Describe The Physical Theories Responsible For Making A Good Joint, The Chemical Actions During Its Formation And The Electrical, Thermal And Mechanical Requirements Essential To Ensure Its Reliability. The Four M'S; Material, Machine, Method And Man, Necessary For Designing A Solder Joint Have Been Described In Detail. Further, Process Control, Solder Joint Inspection Criteria, Solder Joint Defect Analysis And Its Repair/Rework Are Also Discussed.Additionally, Brief Introductions To Surface Mount Devices (Smd) And Surface Mount Technology (Smt) Have Been Included A Annexures. The Book Will Be Useful In Industry, And To Design Production, Process Planning And Quality Control Engineers, As Well As In Engineering/Technical Colleges To Students As A Reference Book For The Present And, Hopefully, Future Modified Courses. The Academicians May Find This Book Useful For Redesigning The Present Diploma (Electronics), B.Sc. (Electronics), B.Sc. (Instrumentation), B.E. And M.E. / M.Tech (Electrical, Electronic, Instrumentation) Syllabus.

Lead Free Solder Interconnect Reliability

Lead Free Solder Interconnect Reliability
Author: Dongkai Shangguan
Publsiher: ASM International
Total Pages: 292
Release: 2005
ISBN 10: 161503093X
ISBN 13: 9781615030934
Language: EN, FR, DE, ES & NL

Lead Free Solder Interconnect Reliability Book Review:

Lead Free Soldering

Lead Free Soldering
Author: Jasbir Bath
Publsiher: Springer Science & Business Media
Total Pages: 299
Release: 2007-06-26
ISBN 10: 0387684220
ISBN 13: 9780387684222
Language: EN, FR, DE, ES & NL

Lead Free Soldering Book Review:

The worldwide trend toward lead-free components and soldering is especially urgent in the European Union with the implementation strict new standards in July 2006, and with pending implementation of laws in China and California. This book provides a standard reference guide for engineers who must meet the new regulations, including a broad collection of techniques for lead-free soldering design and manufacture, which up to now have been scattered in difficult-to-find scholarly sources.

Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects
Author: Darrel R. Frear,Steven N. Burchett,Harold S. Morgan,John H. Lau
Publsiher: Springer Science & Business Media
Total Pages: 418
Release: 1994-01-31
ISBN 10: 9780442015053
ISBN 13: 0442015054
Language: EN, FR, DE, ES & NL

Mechanics of Solder Alloy Interconnects Book Review:

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

Brazing and Soldering 2012

Brazing and Soldering 2012
Author: Robbin Gourley
Publsiher: ASM International
Total Pages: 516
Release: 2012
ISBN 10: 1615039937
ISBN 13: 9781615039937
Language: EN, FR, DE, ES & NL

Brazing and Soldering 2012 Book Review:

Surface Mount Technology

Surface Mount Technology
Author: Ray Prasad
Publsiher: Springer Science & Business Media
Total Pages: 772
Release: 2013-11-27
ISBN 10: 1461540844
ISBN 13: 9781461540847
Language: EN, FR, DE, ES & NL

Surface Mount Technology Book Review:

A foreword is usually prepared by someone who knows the author or who knows enough to provide additional insight on the purpose of the work. When asked to write this foreword, I had no problem with what I wanted to say about the work or the author. I did, however, wonder why people read a foreword. It is probably of value to know the background of the writer of a book; it is probably also of value to know the background of the individual who is commenting on the work. I consider myself a good friend of the author, and when I was asked to write a few words I felt honored to provide my view of Ray Prasad, his expertise, and the contribution that he has made to our industry. This book is about the industry, its technology, and its struggle to learn and compete in a global market bursting with new ideas to satisfy a voracious appetite for new and innovative electronic products. I had the good fortune to be there at the beginning (or almost) and have witnessed the growth and excitement in the opportunities and challenges afforded the electronic industries' engineering and manufacturing talents. In a few years my involve ment will span half a century.

Lead free Soldering Process Development and Reliability

Lead free Soldering Process Development and Reliability
Author: Jasbir Bath
Publsiher: John Wiley & Sons
Total Pages: 512
Release: 2020-06-12
ISBN 10: 1119482046
ISBN 13: 9781119482048
Language: EN, FR, DE, ES & NL

Lead free Soldering Process Development and Reliability Book Review:

Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other topics, the book addresses: · Developments in process engineering (SMT, Wave, Rework, Paste Technology) · Low temperature, high temperature and high reliability alloys · Intermetallic compounds · PCB surface finishes and laminates · Underfills, encapsulants and conformal coatings · Reliability assessments In a regulatory environment that includes the adoption of mandatory lead-free requirements in a variety of countries, the book’s explanations of high-temperature, low-temperature, and high-reliability lead-free alloys in terms of process and reliability implications are invaluable to working engineers. Lead-free Soldering takes a forward-looking approach, with an eye towards developments likely to impact the industry in the coming years. These will include the introduction of lead-free requirements in high-reliability electronics products in the medical, automotive, and defense industries. The book provides practitioners in these and other segments of the industry with guidelines and information to help comply with these requirements.

Springer Handbook of Mechanical Engineering

Springer Handbook of Mechanical Engineering
Author: Grote Jark-Heinrich,Erik K. Antonsson
Publsiher: Springer Science & Business Media
Total Pages: 1580
Release: 2009-01-13
ISBN 10: 3540491317
ISBN 13: 9783540491316
Language: EN, FR, DE, ES & NL

Springer Handbook of Mechanical Engineering Book Review:

This resource covers all areas of interest for the practicing engineer as well as for the student at various levels and educational institutions. It features the work of authors from all over the world who have contributed their expertise and support the globally working engineer in finding a solution for today‘s mechanical engineering problems. Each subject is discussed in detail and supported by numerous figures and tables.

Microelectronics Technology and Devices SBMICRO 2003

Microelectronics Technology and Devices  SBMICRO 2003
Author: J. A. Martino,Sociedade Brasileira de Microeletrônica
Publsiher: The Electrochemical Society
Total Pages: 462
Release: 2003
ISBN 10: 9781566773898
ISBN 13: 156677389X
Language: EN, FR, DE, ES & NL

Microelectronics Technology and Devices SBMICRO 2003 Book Review:

Lead Free Soldering in Electronics

Lead Free Soldering in Electronics
Author: Katsuaki Suganuma
Publsiher: CRC Press
Total Pages: 376
Release: 2003-12-11
ISBN 10: 9780203025772
ISBN 13: 0203025776
Language: EN, FR, DE, ES & NL

Lead Free Soldering in Electronics Book Review:

Assessing the scientific and technological aspects of lead-free soldering, Lead-Free Soldering in Electronics considers the necessary background and requirements for proper alloy selection. It highlights the metallurgical and mechanical properties; plating and processing technologies; and evaluation methods vital to the production of lead-free sold

Manufacturing Challenges in Electronic Packaging

Manufacturing Challenges in Electronic Packaging
Author: Y.C. Lee,W.T. Chen
Publsiher: Springer Science & Business Media
Total Pages: 261
Release: 2012-12-06
ISBN 10: 1461558034
ISBN 13: 9781461558033
Language: EN, FR, DE, ES & NL

Manufacturing Challenges in Electronic Packaging Book Review:

About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews and in-depth discussions on the advanced topics surrounding packaging and manufacturing. The first chapter gives a comprehensive review of manufacturing chal lenges in electronic packaging based on trends predicted by different resources. Almost all the functional specifications have already been met by technologies demonstrated in laboratories. However, it would take tremendous efforts to implement these technologies for mass production or flexible manufacturing. The topics crucial to this implementation are discussed in the following chapters: Chapter 2: Challenges in solder assembly technologies; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based products are very competitive and becoming more and more application-specific. Their packages should fulfill cost, speed, power, weight, size, reliability and time-to-market requirements. More importantly, the packages should be manufacturable in mass or flexible production lines. These chapters are excellent references for professionals who need to meet the challenge through design and manufacturing improvements. This book will also introduce students to the critical issues for competitive design and manufacturing in electronic packaging.

Handbook of Lead Free Solder Technology for Microelectronic Assemblies

Handbook of Lead Free Solder Technology for Microelectronic Assemblies
Author: Karl J. Puttlitz,Kathleen A. Stalter
Publsiher: CRC Press
Total Pages: 1048
Release: 2004-02-27
ISBN 10: 082475249X
ISBN 13: 9780824752491
Language: EN, FR, DE, ES & NL

Handbook of Lead Free Solder Technology for Microelectronic Assemblies Book Review:

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners, the book discusses general reliability issues concerning microelectronic assemblies, as well as factors specific to the tin-rich replacement alloys commonly utilized in lead-free solders. It provides real-world manufacturing accounts of the introduction of reduced-lead and lead-free technology and discusses the functionality and cost effectiveness of alternative solder alloys and non-solder alternatives replacing lead-tin solders in microelectronics.

Solder Joint Reliability

Solder Joint Reliability
Author: John H. Lau
Publsiher: Springer Science & Business Media
Total Pages: 631
Release: 2013-11-27
ISBN 10: 1461539102
ISBN 13: 9781461539100
Language: EN, FR, DE, ES & NL

Solder Joint Reliability Book Review:

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

Novel Structured Metallic and Inorganic Materials

Novel Structured Metallic and Inorganic Materials
Author: Yuichi Setsuhara,Toshio Kamiya,Shin-ichi Yamaura
Publsiher: Springer
Total Pages: 620
Release: 2019-07-01
ISBN 10: 9811376115
ISBN 13: 9789811376115
Language: EN, FR, DE, ES & NL

Novel Structured Metallic and Inorganic Materials Book Review:

This book describes a series of research topics investigated during the 6 years from 2010 through 2015 in the project "Advanced Materials Development and Integration of Novel Structured Metallic and Inorganic Materials". Every section of the book is aimed at understanding the most advanced research by describing details starting with the fundamentals as often as possible. Because both fundamental and cutting-edge topics are contained in this book, it provides a great deal of useful information for chemists as well as for materials scientists and engineers who wish to consider future prospects and innovations. The contents of Novel Structured Metallic and Inorganic Materials are unique in materials science and technology. The project was carried out through the cooperation of research groups in the following six institutes in Japan: the Institute for Materials Research (IMR), Tohoku University; the Materials and Structures Laboratory (MSL), Tokyo Institute of Technology; the Joining and Welding Research Institute (JWRI), Osaka University; the Eco-Topia Science Institute (EST), Nagoya University; the Institute of Biomaterials and Bioengineering (IBB), Tokyo Medical and Dental University; and the Institute for Nanoscience and Nanotechnology (INN), Waseda University. Major objectives of the project included creation of advanced metallic and inorganic materials with a novel structure, as well as development of materials-joining technologies for development of cutting-edge applications as environmental and energy materials, biomedical materials, and electronic materials for contributing to the creation of a safer and more secure society.

The Electronics Assembly Handbook

The Electronics Assembly Handbook
Author: Frank Riley,Electronic Packaging and Production
Publsiher: Springer Science & Business Media
Total Pages: 603
Release: 2013-06-29
ISBN 10: 3662131617
ISBN 13: 9783662131619
Language: EN, FR, DE, ES & NL

The Electronics Assembly Handbook Book Review:

The assembly of electronic circuit boards has emerged as one of the most significant growth areas for robotics and automated assembly. This comprehensive volume, which is an edited collection of material mostly published in "Assembly Engineering" and "Electronic Packaging and Production", will provide an essential reference for engineers working in this field, including material on Multi Layer Boards, Chip-on-board and numerous case studies. Frank J. Riley is senior vice-president of the Bodine Corporation and a world authority on assembly automation.