Reliability and Failure Analysis of High Power LED Packaging

Reliability and Failure Analysis of High Power LED Packaging
Author: Cher Ming Tan,Preetpal Singh
Publsiher: Woodhead Publishing
Total Pages: 265
Release: 2021-08-15
ISBN 10: 9780128224083
ISBN 13: 0128224088
Language: EN, FR, DE, ES & NL

Reliability and Failure Analysis of High Power LED Packaging Book Review:

Reliability and Failure Analysis of High Power LED Packaging provides the fundamental understanding of the reliability and failure analysis materials interfaces for high power LEDs packaging with the ultimate goal of enabling new packaging materials. This book describes the limitations of the present reliability standards in determining the lifetime of high-power LEDs due to the lack of deep understanding of the packaging materials and their interaction with each other. Many new failure mechanisms are investigated and presented with consideration of the different stresses imposed by varying environmental conditions. The detailed failure mechanisms are unique to this book and will provide new insights for readers regarding the different possible failure mechanisms in high power LEDs. The authors also show the importance of simulation in understanding the hidden failure mechanisms in LEDs. Along with simulation, the use of various destructive and non-destructive tools such as C-SAM, SEM, FTIR, Optical Microscopy, etc. in investigation of the causes of LED failures are reviewed. The advancement of LEDs in the last two decades has opened vast new applications for LEDs which also has led to a harsher stress conditions that high-power LEDs have to face. Thus, existing standards and reliability tests need to be revised to meet the new demands for high-power LEDs. Introduces the failure mechanisms of high power LEDs under varying environmental conditions and methods of how to test, simulate and predict them Describes the chemistry underlying the material degradation and its impact on LEDs Discusses future directions of new packaging materials for improved performance and reliability of high power LEDs

Solid State Lighting Reliability

Solid State Lighting Reliability
Author: W.D. van Driel,X.J. Fan
Publsiher: Springer Science & Business Media
Total Pages: 618
Release: 2012-09-06
ISBN 10: 1461430674
ISBN 13: 9781461430674
Language: EN, FR, DE, ES & NL

Solid State Lighting Reliability Book Review:

Solid State Lighting Reliability: Components to Systems begins with an explanation of the major benefits of solid state lighting (SSL) when compared to conventional lighting systems including but not limited to long useful lifetimes of 50,000 (or more) hours and high efficacy. When designing effective devices that take advantage of SSL capabilities the reliability of internal components (optics, drive electronics, controls, thermal design) take on critical importance. As such a detailed discussion of reliability from performance at the device level to sub components is included as well as the integrated systems of SSL modules, lamps and luminaires including various failure modes, reliability testing and reliability performance. A follow-up, Solid State Lighting Reliability Part 2, was published in 2017.

LED Packaging for Lighting Applications

LED Packaging for Lighting Applications
Author: Sheng Liu,Xiaobing Luo
Publsiher: John Wiley & Sons
Total Pages: 352
Release: 2011-07-05
ISBN 10: 0470827831
ISBN 13: 9780470827833
Language: EN, FR, DE, ES & NL

LED Packaging for Lighting Applications Book Review:

"This book provides quantitative methods for optical, thermal, reliability modelling and simulation so that predictive quantitative modelling can be achieved"--

Solid State Lighting Reliability Part 2

Solid State Lighting Reliability Part 2
Author: Willem Dirk van Driel,Xuejun Fan,Guo Qi Zhang
Publsiher: Springer
Total Pages: 606
Release: 2017-07-11
ISBN 10: 3319581759
ISBN 13: 9783319581750
Language: EN, FR, DE, ES & NL

Solid State Lighting Reliability Part 2 Book Review:

In the past four years we have witnessed rapid development in technology and significant market penetration in many applications for LED systems. New processes and new materials have been introduced; new standards and new testing methods have been developed; new driver, control and sensing technologies have been integrated; and new and unknown failure modes have also been presented. In this book, Solid State Lighting Reliability Part 2, we invited the experts from industry and academia to present the latest developments and findings in the LED system reliability arena. Topics in this book cover the early failures and critical steps in LED manufacturing; advances in reliability testing and standards; quality of colour and colour stability; degradation of optical materials and the associated chromaticity maintenance; characterization of thermal interfaces; LED solder joint testing and prediction; common failure modes in LED drivers; root causes for lumen depreciation; corrosion sensitivity of LED packages; reliability management for automotive LEDs, and lightning effects on LEDs. This book is a continuation of Solid State Lighting Reliability: Components to Systems (published in 2013), which covers reliability aspects ranging from the LED to the total luminaire or system of luminaires. Together, these two books are a full set of reference books for Solid State Lighting reliability from the performance of the (sub-) components to the total system, regardless its complexity.

International Conference on Energy and Power Engineering EPE2014

International Conference on Energy and Power Engineering  EPE2014
Author: Anonim
Publsiher: DEStech Publications, Inc
Total Pages: 470
Release: 2014-06-24
ISBN 10: 1605951803
ISBN 13: 9781605951805
Language: EN, FR, DE, ES & NL

International Conference on Energy and Power Engineering EPE2014 Book Review:

The 2014 International Conference on Energy and Power Engineering (EPE2014), will be held on April 26–27, 2014, in Hong Kong, China. The aim of this international convention is to bring together experts and scholars from around the world and offer them a chance to share the latest research results in the field of Energy and Power Engineering. We all know that over the past few decades, a great change has happened in the field of the environment technology, and the science technology is growing faster and faster. In order to keep up with the daily changing situation, we have sent invitations to experts, scholars and other people who have devoted himself in related fields, and it is a great honor to us that most of them have accepted our invitation and supported the EPE2014 with their latest studies. Up till now, we have received over three hundred papers from various countries; this shows that there has been a growing interest in the field of energy and power engineering. Among those papers received, we have eventually chosen about a hundred to be presented and included in this proceeding. These papers generally represented the current research status in this field and the future trend. We sincerely believe that these papers could be valuable to the future work of yours. Finally, on behalf of the committee, I would like to deeply express our gratitude to those who have supported the EPE2014, especially the international experts who helped reviewing papers, the DEStech Publications help publish the conference proceedings, and last but not least, the authors of these inspiring papers. Without the help from these people, EPE2014 would not be as half successful as it is now. Here, welcome to EPE2014 and let’s hope that it will be a great success. Tim Chou

Nano Bio Electronic Photonic and MEMS Packaging

Nano Bio  Electronic  Photonic and MEMS Packaging
Author: C. P.(Ching-Ping) Wong,Kyoung-sik (Jack) Moon,Yi Li
Publsiher: Springer Nature
Total Pages: 582
Release: 2021-03-17
ISBN 10: 303049991X
ISBN 13: 9783030499914
Language: EN, FR, DE, ES & NL

Nano Bio Electronic Photonic and MEMS Packaging Book Review:

This book shows how nanofabrication techniques and nanomaterials can be used to customize packaging for nano devices with applications to electronics, photonics, biological and biomedical research and products. It covers topics such as bio sensing electronics, bio device packaging, MEMS for bio devices and much more, including: Offers a comprehensive overview of nano and bio packaging and their materials based on their chemical and physical sciences and mechanical, electrical and material engineering perspectives; Discusses nano materials as power energy sources, computational analyses of nano materials including molecular dynamic (MD) simulations and DFT calculations; Analyzes nanotubes, superhydrophobic self-clean Lotus surfaces; Covers nano chemistry for bio sensor/bio material device packaging. This second edition includes new chapters on soft materials-enabled packaging for stretchable and wearable electronics, state of the art miniaturization for active implantable medical devices, recent LED packaging and progress, nanomaterials for recent energy storage devices such as lithium ion batteries and supercapacitors and their packaging. Nano- Bio- Electronic, Photonic and MEMS Packaging is the ideal book for all biomedical engineers, industrial electronics packaging engineers, and those engaged in bio nanotechnology applications research.

Thermal Management for LED Applications

Thermal Management for LED Applications
Author: Clemens J.M. Lasance,András Poppe
Publsiher: Springer Science & Business Media
Total Pages: 551
Release: 2013-09-17
ISBN 10: 1461450918
ISBN 13: 9781461450917
Language: EN, FR, DE, ES & NL

Thermal Management for LED Applications Book Review:

Thermal Management for LED Applications provides state-of-the-art information on recent developments in thermal management as it relates to LEDs and LED-based systems and their applications. Coverage begins with an overview of the basics of thermal management including thermal design for LEDs, thermal characterization and testing of LEDs, and issues related to failure mechanisms and reliability and performance in harsh environments. Advances and recent developments in thermal management round out the book with discussions on advances in TIMs (thermal interface materials) for LED applications, advances in forced convection cooling of LEDs, and advances in heat sinks for LED assemblies.

Reliability of Organic Compounds in Microelectronics and Optoelectronics

Reliability of Organic Compounds in Microelectronics and Optoelectronics
Author: Willem Dirk van Driel,Maryam Yazdan Mehr
Publsiher: Springer Nature
Total Pages: 135
Release: 2022
ISBN 10: 3030815765
ISBN 13: 9783030815769
Language: EN, FR, DE, ES & NL

Reliability of Organic Compounds in Microelectronics and Optoelectronics Book Review:

This book aims to provide a comprehensive reference into the critical subject of failure and degradation in organic materials, used in optoelectronics and microelectronics systems and devices. Readers in different industrial sectors, including microelectronics, automotive, lighting, oil/gas, and petrochemical will benefit from this book. Several case studies and examples are discussed, which readers will find useful to assess and mitigate similar failure cases. More importantly, this book presents methodologies and useful approaches in analyzing a failure and in relating a failure to the reliability of materials and systems. Presents methodologies for analysing the reliability, failure, and degradation of different organic materials, used in optoelectronics and microelectronics; Provides an overview of different failure mechanisms in different organic materials; Explains how to correlate product performance and reliability to materials degradation; Provides an overview of simulation techniques and methodologies to predict lifetime and reliability of engineering materials and components; Integrates several degradation causes in different materials (thermal, moisture, light radiation, mechanical damage, and more) into large-scale system solutions in several industrial domains (lighting, automotive, oil/gas, and transport and more); Includes case studies from different failure/degradation mechanisms in different industrial sectors.

Microcircuit Reliability Bibliography

Microcircuit Reliability Bibliography
Author: Anonim
Publsiher: Unknown
Total Pages: 135
Release: 1978
ISBN 10: 1928374650XXX
ISBN 13: UOM:39015004479013
Language: EN, FR, DE, ES & NL

Microcircuit Reliability Bibliography Book Review:

Failure Analysis

Failure Analysis
Author: Marius Bazu,Titu Bajenescu
Publsiher: John Wiley & Sons
Total Pages: 344
Release: 2011-03-08
ISBN 10: 9781119990000
ISBN 13: 1119990009
Language: EN, FR, DE, ES & NL

Failure Analysis Book Review:

Failure analysis is the preferred method to investigate product or process reliability and to ensure optimum performance of electrical components and systems. The physics-of-failure approach is the only internationally accepted solution for continuously improving the reliability of materials, devices and processes. The models have been developed from the physical and chemical phenomena that are responsible for degradation or failure of electronic components and materials and now replace popular distribution models for failure mechanisms such as Weibull or lognormal. Reliability engineers need practical orientation around the complex procedures involved in failure analysis. This guide acts as a tool for all advanced techniques, their benefits and vital aspects of their use in a reliability programme. Using twelve complex case studies, the authors explain why failure analysis should be used with electronic components, when implementation is appropriate and methods for its successful use. Inside you will find detailed coverage on: a synergistic approach to failure modes and mechanisms, along with reliability physics and the failure analysis of materials, emphasizing the vital importance of cooperation between a product development team involved the reasons why failure analysis is an important tool for improving yield and reliability by corrective actions the design stage, highlighting the ‘concurrent engineering' approach and DfR (Design for Reliability) failure analysis during fabrication, covering reliability monitoring, process monitors and package reliability reliability resting after fabrication, including reliability assessment at this stage and corrective actions a large variety of methods, such as electrical methods, thermal methods, optical methods, electron microscopy, mechanical methods, X-Ray methods, spectroscopic, acoustical, and laser methods new challenges in reliability testing, such as its use in microsystems and nanostructures This practical yet comprehensive reference is useful for manufacturers and engineers involved in the design, fabrication and testing of electronic components, devices, ICs and electronic systems, as well as for users of components in complex systems wanting to discover the roots of the reliability flaws for their products.

Reliability Investigation of LED Devices for Public Light Applications

Reliability Investigation of LED Devices for Public Light Applications
Author: Raphael Baillot,Yannick Deshayes
Publsiher: Elsevier
Total Pages: 222
Release: 2017-03-09
ISBN 10: 0081010923
ISBN 13: 9780081010921
Language: EN, FR, DE, ES & NL

Reliability Investigation of LED Devices for Public Light Applications Book Review:

Reliability Investigation of LED Devices for Public Light Applications focuses on state-of-the-art GaN-based LED technology through the study of typical failure mechanisms in public lighting applications. Across the different chapters, the reader will explore the tools and analyses involved in the study and application of a number of different LED devices. The authors review GaN-based LED technology by focusing on the main failure mechanisms targeting polymer-based packaging, thanks to electrical and spectral models. The proposed technology and methodologies will help those interested in the topic to further their knowledge of failure mechanisms, exploring the physical and chemical analyses involved. Based on the work of two main Phd results in 2011 and 2014 Describes GaN technology in the state-of-the-art, focusing on the specific electrical and spectral model Proposes the technology and methodologies to understand failure mechanisms

Component Reliability for Electronic Systems

Component Reliability for Electronic Systems
Author: Titu I. Băjenescu,Marius I. Bâzu
Publsiher: Artech House
Total Pages: 685
Release: 2010
ISBN 10: 1596934360
ISBN 13: 9781596934368
Language: EN, FR, DE, ES & NL

Component Reliability for Electronic Systems Book Review:

The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

Organosilicon Compounds

Organosilicon Compounds
Author: Vladimir Ya Lee
Publsiher: Academic Press
Total Pages: 410
Release: 2017-09-25
ISBN 10: 0128142146
ISBN 13: 9780128142141
Language: EN, FR, DE, ES & NL

Organosilicon Compounds Book Review:

Organosilicon Compounds: Experiment (Physico-Chemical Studies) and Applications, volume 2, also contains two parts. In its first part, Experiment (Physico-Chemical Studies), the application of modern instrumental tools (such as X-ray crystallography, 29Si NMR spectroscopy, UV-Photoelectron Spectroscopy, and other methods) for assessing the structures of organosilicon compounds is described. The second part, Applications, reviews the current research in the field of material science, specifically the use of organosilicon compounds in synthetic chemistry directed towards the creation of new materials. Organosilicon Compounds: From Theory to Synthesis to Applications provides a comprehensive overview of this important area of organic and organometallic chemistry, dealing with compounds containing carbon–silicon bonds. This field, which includes compounds that are widely encountered in commercial products such as in the fabrication of sealants, adhesives, and coatings, has seen many milestone discoveries reported during the last two decades. Beginning with the theoretical aspects of organosilicon compounds’ structure and bonding, the book then explores their synthetic aspects, including main group element organosilicon compounds, transition metal complexes, silicon cages and clusters, low-coordinate organosilicon derivatives (cations, radicals, anions, multiple bonds to silicon, silaaromatics), and more. Next, readers will find valuable sections that explore physical and chemical properties of organosilicon compounds by means of X-ray crystallography, 29Si NMR spectroscopy, photoelectron spectroscopy, and other methods. Finally, the work delves into applications for industrial uses and in many related fields, such as polymers, material science, nanotechnology, bioorganics, and medicinal silicon chemistry. Features valuable contributions from prominent experts cover both fundamental (theoretical, synthetic, physico-chemical) and applied (material science, applications) aspects of modern organosilicon chemistry Covers important breakthroughs in the field as well as with the historically significant achievements of the past Includes applied information for a wide range of specialists from junior and senior researchers (from both academia and industry), working in organometallic, organosilicon, main group element, transition metal, and industrial silicon chemistry, as well as those from interdisciplinary fields such as polymer, material science, nanotechnology

From LED to Solid State Lighting

From LED to Solid State Lighting
Author: S. W. Ricky Lee,Jeffery C. C. Lo,Mian Tao,Huaiyu Ye
Publsiher: John Wiley & Sons
Total Pages: 256
Release: 2021-09-28
ISBN 10: 1118881478
ISBN 13: 9781118881477
Language: EN, FR, DE, ES & NL

From LED to Solid State Lighting Book Review:

A comprehensive reference including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • An introductory/intermediate level treatment including practical, hands-on exercises and data of experimental studies, written by leading researchers in the field • The authors lead a LED packaging R&D center with an industrial grade prototyping line and state-of-the-art facilities for materials/optical/electrical/thermal characterization. A substantial amount of technical contents in this book is based on the hands-on experience and experimental practices of the authors • The manufacture of LED-based luminaries for lighting is a huge area and there is a need for a comprehensive book instructing engineers and designers in the lighting industry • Includes packaging LED components such as interconnection, phosphor deposition, encapsulation, thermal management and reliability, making this an excellent reference and background reading for engineers and researchers

III Nitride Based Light Emitting Diodes and Applications

III Nitride Based Light Emitting Diodes and Applications
Author: Tae-Yeon Seong,Jung Han,Hiroshi Amano,Hadis Morkoç
Publsiher: Springer
Total Pages: 495
Release: 2017-05-18
ISBN 10: 9811037558
ISBN 13: 9789811037559
Language: EN, FR, DE, ES & NL

III Nitride Based Light Emitting Diodes and Applications Book Review:

The revised edition of this important book presents updated and expanded coverage of light emitting diodes (LEDs) based on heteroepitaxial GaN on Si substrates, and includes new chapters on tunnel junction LEDs, green/yellow LEDs, and ultraviolet LEDs. Over the last two decades, significant progress has been made in the growth, doping and processing technologies of III-nitride based semiconductors, leading to considerable expectations for nitride semiconductors across a wide range of applications. LEDs are already used in traffic signals, signage lighting, and automotive applications, with the ultimate goal of the global replacement of traditional incandescent and fluorescent lamps, thus reducing energy consumption and cutting down on carbon-dioxide emission. However, some critical issues must be addressed to allow the further improvements required for the large-scale realization of solid-state lighting, and this book aims to provide the readers with details of some contemporary issues on which the performance of LEDs is seriously dependent. Most importantly, it describes why there must be a breakthrough in the growth of high-quality nitride semiconductor epitaxial layers with a low density of dislocations, in particular, in the growth of Al-rich and In-rich GaN-based semiconductors. The quality of materials is directly dependent on the substrates used, such as sapphire and Si, and the book discusses these as well as topics such as efficiency droop, growth in different orientations, polarization, and chip processing and packaging technologies. Offering an overview of the state of the art in III-Nitride LED science and technology, the book will be a core reference for researchers and engineers involved with the developments of solid state lighting, and required reading for students entering the field.

Reliability of RoHS Compliant 2D and 3D IC Interconnects

Reliability of RoHS Compliant 2D and 3D IC Interconnects
Author: John Lau
Publsiher: McGraw Hill Professional
Total Pages: 560
Release: 2010-10-22
ISBN 10: 007175380X
ISBN 13: 9780071753807
Language: EN, FR, DE, ES & NL

Reliability of RoHS Compliant 2D and 3D IC Interconnects Book Review:

Proven 2D and 3D IC lead-free interconnect reliability techniques Reliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource. Covers reliability of: 2D and 3D IC lead-free interconnects CCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder joints Lead-free (SACX) solder joints Low-temperature lead-free (SnBiAg) solder joints Solder joints with voids, high strain rate, and high ramp rate VCSEL and LED lead-free interconnects 3D LED and 3D MEMS with TSVs Chip-to-wafer (C2W) bonding and lead-free interconnects Wafer-to-wafer (W2W) bonding and lead-free interconnects 3D IC chip stacking with low-temperature bonding TSV interposers and lead-free interconnects Electromigration of lead-free microbumps for 3D IC integration

Seeing Photons

Seeing Photons
Author: National Research Council,Division on Engineering and Physical Sciences,Standing Committee on Technology Insightâ¬"Gauge, Evaluate, and Review,Committee on Developments in Detector Technologies
Publsiher: National Academies Press
Total Pages: 194
Release: 2010-10-28
ISBN 10: 0309153042
ISBN 13: 9780309153041
Language: EN, FR, DE, ES & NL

Seeing Photons Book Review:

The Department of Defense recently highlighted intelligence, surveillance, and reconnaissance (ISR) capabilities as a top priority for U.S. warfighters. Contributions provided by ISR assets in the operational theaters in Iraq and Afghanistan have been widely documented in press reporting. While the United States continues to increase investments in ISR capabilities, other nations not friendly to the United States will continue to seek countermeasures to U.S. capabilities. The Technology Warning Division of the Defense Intelligence Agency's (DIA) Defense Warning Office (DWO) has the critical responsibility, in collaborations with other components of the intelligence community (IC), for providing U.S. policymakers insight into technological developments that may impact future U.S. warfighting capabilities. To this end, the IC requested that the National Research Council (NRC) investigate and report on key visible and infrared detector technologies, with potential military utility, that are likely to be developed in the next 10-15 years. This study is the eighth in a series sponsored by the DWO and executed under the auspices of the NRC TIGER (Technology Insight-Gauge, Evaluate, and Review) Standing Committee.

Reliability of Electronic Components

Reliability of Electronic Components
Author: Titu I. Bajenescu,Marius I. Bazu
Publsiher: Springer Science & Business Media
Total Pages: 509
Release: 2012-12-06
ISBN 10: 3642585051
ISBN 13: 9783642585050
Language: EN, FR, DE, ES & NL

Reliability of Electronic Components Book Review:

This application-oriented professional book explains why components fail, addressing the needs of engineers who apply reliability principles in design, manufacture, testing and field service. A detailed index, a glossary, acronym lists, reliability dictionaries and a rich specific bibliography complete the book.

Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly
Author: Sheng Liu,Yong Liu
Publsiher: John Wiley & Sons
Total Pages: 288
Release: 2011-08-24
ISBN 10: 0470828412
ISBN 13: 9780470828410
Language: EN, FR, DE, ES & NL

Modeling and Simulation for Microelectronic Packaging Assembly Book Review:

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging

High reliability Devices

High reliability Devices
Author: RCA Corporation. Solid State Division
Publsiher: Unknown
Total Pages: 135
Release: 1973
ISBN 10: 1928374650XXX
ISBN 13: UOM:39015004523661
Language: EN, FR, DE, ES & NL

High reliability Devices Book Review: