Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP
Author: Suryadevara Babu
Publsiher: Woodhead Publishing
Total Pages: 648
Release: 2021-09-24
ISBN 10: 0128218193
ISBN 13: 9780128218198
Language: EN, FR, DE, ES & NL

Advances in Chemical Mechanical Planarization CMP Book Review:

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices
Author: Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
Publsiher: William Andrew
Total Pages: 317
Release: 2011-12
ISBN 10: 1437778593
ISBN 13: 9781437778595
Language: EN, FR, DE, ES & NL

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices Book Review:

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Advances in Chemical mechanical Planarization

Advances in Chemical mechanical Planarization
Author: Rajiv K. Singh,Rajeev Bajaj,Materials Research Society
Publsiher: Unknown
Total Pages: 41
Release: 2002
ISBN 10: 1928374650XXX
ISBN 13: OCLC:437132930
Language: EN, FR, DE, ES & NL

Advances in Chemical mechanical Planarization Book Review:

Advances and Challenges in Chemical Mechanical Planarization

Advances and Challenges in Chemical Mechanical Planarization
Author: Anonim
Publsiher: Unknown
Total Pages: 371
Release: 2007
ISBN 10: 1928374650XXX
ISBN 13: OCLC:180064638
Language: EN, FR, DE, ES & NL

Advances and Challenges in Chemical Mechanical Planarization Book Review:

Microelectronic Applications of Chemical Mechanical Planarization

Microelectronic Applications of Chemical Mechanical Planarization
Author: Yuzhuo Li
Publsiher: John Wiley & Sons
Total Pages: 760
Release: 2007-10-19
ISBN 10: 0471719196
ISBN 13: 9780471719199
Language: EN, FR, DE, ES & NL

Microelectronic Applications of Chemical Mechanical Planarization Book Review:

An authoritative, systematic, and comprehensive description of current CMP technology Chemical Mechanical Planarization (CMP) provides the greatest degree of planarization of any known technique. The current standard for integrated circuit (IC) planarization, CMP is playing an increasingly important role in other related applications such as microelectromechanical systems (MEMS) and computer hard drive manufacturing. This reference focuses on the chemical aspects of the technology and includes contributions from the foremost experts on specific applications. After a detailed overview of the fundamentals and basic science of CMP, Microelectronic Applications of Chemical Mechanical Planarization: * Provides in-depth coverage of a wide range of state-of-the-art technologies and applications * Presents information on new designs, capabilities, and emerging technologies, including topics like CMP with nanomaterials and 3D chips * Discusses different types of CMP tools, pads for IC CMP, modeling, and the applicability of tribometrology to various aspects of CMP * Covers nanotopography, CMP performance and defect profiles, CMP waste treatment, and the chemistry and colloidal properties of the slurries used in CMP * Provides a perspective on the opportunities and challenges of the next fifteen years Complete with case studies, this is a valuable, hands-on resource for professionals, including process engineers, equipment engineers, formulation chemists, IC manufacturers, and others. With systematic organization and questions at the end of each chapter to facilitate learning, it is an ideal introduction to CMP and an excellent text for students in advanced graduate courses that cover CMP or related semiconductor manufacturing processes.

Emerging Contaminants

Emerging Contaminants
Author: Aurel Nuro
Publsiher: BoD – Books on Demand
Total Pages: 332
Release: 2021-05-27
ISBN 10: 1839624183
ISBN 13: 9781839624186
Language: EN, FR, DE, ES & NL

Emerging Contaminants Book Review:

Emerging Contaminants presents the reader with information on classification, recent studies, and adverse effects on the environment and human health of the main classes of contaminants. Emerging contaminants are synthetic or natural compounds and microorganisms produced and used by humans that cause adverse ecological and human health effects when they reach the environment. This book is organized into four sections that cover the classification of contaminants and the instrumental techniques used to quantify them, recent studies on pesticides, antibiotics as an important group of emerging contaminants, and studies of different classes of emerging contaminants such as polybrominated diphenyl ethers (PBDEs), microplastics, and others.

Abrasive Technology

Abrasive Technology
Author: Anna Rudawska
Publsiher: BoD – Books on Demand
Total Pages: 212
Release: 2018-10-24
ISBN 10: 1789841933
ISBN 13: 9781789841930
Language: EN, FR, DE, ES & NL

Abrasive Technology Book Review:

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Microelectronic Packaging

Microelectronic Packaging
Author: M. Datta,Tetsuya Osaka,J. Walter Schultze
Publsiher: CRC Press
Total Pages: 568
Release: 2004-12-20
ISBN 10: 020347368X
ISBN 13: 9780203473689
Language: EN, FR, DE, ES & NL

Microelectronic Packaging Book Review:

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.

Advances in Chemical Mechanical Polishing Volume 816

Advances in Chemical Mechanical Polishing  Volume 816
Author: Materials Research Society. Meeting
Publsiher: Unknown
Total Pages: 318
Release: 2004-09
ISBN 10: 1928374650XXX
ISBN 13: UOM:39015059125883
Language: EN, FR, DE, ES & NL

Advances in Chemical Mechanical Polishing Volume 816 Book Review:

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of chemical-mechanical polishing (CMP).

Wafer Manufacturing Shaping of Single Crystal Silicon Wafers

Wafer Manufacturing  Shaping of Single Crystal Silicon Wafers
Author: Imin Cao,Milind Bhagavat
Publsiher: John Wiley & Sons
Total Pages: 375
Release: 2021-03-22
ISBN 10: 0470061219
ISBN 13: 9780470061213
Language: EN, FR, DE, ES & NL

Wafer Manufacturing Shaping of Single Crystal Silicon Wafers Book Review:

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Advanced Nanoscale ULSI Interconnects Fundamentals and Applications

Advanced Nanoscale ULSI Interconnects  Fundamentals and Applications
Author: Yosi Shacham-Diamand,Tetsuya Osaka,Madhav Datta,Takayuki Ohba
Publsiher: Springer Science & Business Media
Total Pages: 552
Release: 2009-09-19
ISBN 10: 0387958681
ISBN 13: 9780387958682
Language: EN, FR, DE, ES & NL

Advanced Nanoscale ULSI Interconnects Fundamentals and Applications Book Review:

In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous “Moore’s law” which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions.

Advances in Abrasive Based Machining and Finishing Processes

Advances in Abrasive Based Machining and Finishing Processes
Author: S. Das,G. Kibria,B. Doloi,B. Bhattacharyya
Publsiher: Springer Nature
Total Pages: 271
Release: 2020-05-10
ISBN 10: 3030433129
ISBN 13: 9783030433123
Language: EN, FR, DE, ES & NL

Advances in Abrasive Based Machining and Finishing Processes Book Review:

This book presents the advances in abrasive based machining and finishing in broad sense. Specifically, the book covers the novel machining and finishing strategies implemented in various advanced machining processes for improving machining accuracy and overall quality of the product. This book presents the capability of advanced machining processes using abrasive grain. It also covers ways for enhancing the production rate as well as quality. It fulfills the gap between the production of any complicated components and successful machining with abrasive particles.

Advanced Interconnects for ULSI Technology

Advanced Interconnects for ULSI Technology
Author: Mikhail Baklanov,Paul S. Ho,Ehrenfried Zschech
Publsiher: John Wiley & Sons
Total Pages: 624
Release: 2012-02-17
ISBN 10: 1119966868
ISBN 13: 9781119966869
Language: EN, FR, DE, ES & NL

Advanced Interconnects for ULSI Technology Book Review:

Finding new materials for copper/low-k interconnects is critical to the continuing development of computer chips. While copper/low-k interconnects have served well, allowing for the creation of Ultra Large Scale Integration (ULSI) devices which combine over a billion transistors onto a single chip, the increased resistance and RC-delay at the smaller scale has become a significant factor affecting chip performance. Advanced Interconnects for ULSI Technology is dedicated to the materials and methods which might be suitable replacements. It covers a broad range of topics, from physical principles to design, fabrication, characterization, and application of new materials for nano-interconnects, and discusses: Interconnect functions, characterisations, electrical properties and wiring requirements Low-k materials: fundamentals, advances and mechanical properties Conductive layers and barriers Integration and reliability including mechanical reliability, electromigration and electrical breakdown New approaches including 3D, optical, wireless interchip, and carbon-based interconnects Intended for postgraduate students and researchers, in academia and industry, this book provides a critical overview of the enabling technology at the heart of the future development of computer chips.

Chemical Mechanical Planarization VI

Chemical Mechanical Planarization VI
Author: Sudipta Seal
Publsiher: The Electrochemical Society
Total Pages: 358
Release: 2003
ISBN 10: 9781566774048
ISBN 13: 1566774047
Language: EN, FR, DE, ES & NL

Chemical Mechanical Planarization VI Book Review:

Chemical Mechanical Planarization of Semiconductor Materials

Chemical Mechanical Planarization of Semiconductor Materials
Author: M.R. Oliver
Publsiher: Springer Science & Business Media
Total Pages: 428
Release: 2004-01-26
ISBN 10: 9783540431817
ISBN 13: 3540431810
Language: EN, FR, DE, ES & NL

Chemical Mechanical Planarization of Semiconductor Materials Book Review:

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Handbook of Silicon Wafer Cleaning Technology 2nd Edition

Handbook of Silicon Wafer Cleaning Technology  2nd Edition
Author: Karen Reinhardt,Werner Kern
Publsiher: William Andrew
Total Pages: 660
Release: 2008-12-10
ISBN 10: 0815517734
ISBN 13: 9780815517733
Language: EN, FR, DE, ES & NL

Handbook of Silicon Wafer Cleaning Technology 2nd Edition Book Review:

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol

Chemical Mechanical Planarization in IC Device Manufacturing III

Chemical Mechanical Planarization in IC Device Manufacturing III
Author: Robert Leon Opila
Publsiher: The Electrochemical Society
Total Pages: 644
Release: 2000
ISBN 10: 9781566772600
ISBN 13: 1566772605
Language: EN, FR, DE, ES & NL

Chemical Mechanical Planarization in IC Device Manufacturing III Book Review:

This volume contains the proceedings of the third international symposium on Chemical Mechanical Planarization integrated circuit device manufacturing held at the 196th Meeting of the Electrochemical Society in Honolulu, Hawaii. ( October 20 -22 1999).

Chemical Mechanical Planarization of Semiconductor Materials

Chemical Mechanical Planarization of Semiconductor Materials
Author: M.R. Oliver
Publsiher: Springer Science & Business Media
Total Pages: 428
Release: 2013-03-14
ISBN 10: 3662062348
ISBN 13: 9783662062340
Language: EN, FR, DE, ES & NL

Chemical Mechanical Planarization of Semiconductor Materials Book Review:

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Chemical Mechanical Planarization of Microelectronic Materials

Chemical Mechanical Planarization of Microelectronic Materials
Author: Joseph M. Steigerwald,Shyam P. Murarka,Ronald J. Gutmann
Publsiher: John Wiley & Sons
Total Pages: 337
Release: 2008-09-26
ISBN 10: 3527617752
ISBN 13: 9783527617753
Language: EN, FR, DE, ES & NL

Chemical Mechanical Planarization of Microelectronic Materials Book Review:

Chemical Mechanical Planarization (CMP) plays an important role in today's microelectronics industry. With its ability to achieve global planarization, its universality (material insensitivity), its applicability to multimaterial surfaces, and its relative cost-effectiveness, CMP is the ideal planarizing medium for the interlayered dielectrics and metal films used in silicon integrated circuit fabrication. But although the past decade has seen unprecedented research and development into CMP, there has been no single-source reference to this rapidly emerging technology-until now. Chemical Mechanical Planarization of Microelectronic Materials provides engineers and scientists working in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP. Authors Steigerwald, Murarka, and Gutmann-all leading CMP pioneers-provide a historical overview of CMP, explain the various chemical and mechanical concepts involved, describe CMP materials and processes, review the latest scientific data on CMP worldwide, and offer examples of its uses in the microelectronics industry. They provide detailed coverage of the CMP of various materials used in the making of microcircuitry: tungsten, aluminum, copper, polysilicon, and various dielectric materials, including polymers. The concluding chapter describes post-CMP cleaning techniques, and most chapters feature problem sets to assist readers in developing a more practical understanding of CMP. The only comprehensive reference to one of the fastest growing integrated circuit manufacturing technologies, Chemical Mechanical Planarization of Microelectronic Materials is an important resource for research scientists and engineers working in the microelectronics industry. An indispensable resource for scientists and engineers working in the microelectronics industry Chemical Mechanical Planarization of Microelectronic Materials is the only comprehensive single-source reference to one of the fastest growing integrated circuit manufacturing technologies. It provides engineers and scientists who work in the microelectronics industry with unified coverage of both the fundamental mechanisms and engineering applications of CMP, including: * The history of CMP * Chemical and mechanical underpinnings of CMP * CMP materials and processes * Applications of CMP in the microelectronics industry * The CMP of tungsten, aluminum, copper, polysilicon, and various dielectrics, including polymers used in integrated circuit fabrication * Post-CMP cleaning techniques * Chapter-end problem sets are also included to assist readers in developing a practical understanding of CMP.

Advances and Challenges in Chemical Mechanical Planarization

Advances and Challenges in Chemical Mechanical Planarization
Author: Gerfried Zwicker,Christopher Borst,Laertis Economikos,Ara Philipossian
Publsiher: Cambridge University Press
Total Pages: 371
Release: 2007-11-13
ISBN 10: 9781558999510
ISBN 13: 1558999515
Language: EN, FR, DE, ES & NL

Advances and Challenges in Chemical Mechanical Planarization Book Review:

Chemical mechanical planarization (CMP) has been a leading-edge technology in semiconductor processing for the past 15−20 years. A successful CMP process is based in fundamental science across the disciplines of mechanical engineering, chemical engineering, colloid science, materials science and chemistry. Traditionally, the MRS Spring Meeting serves as a nexus for multidisciplinary interaction and discussion between CMP researchers in both industry and academia. The papers in this book are from the 2007 MRS Spring Meeting and address the fluid and wear mechanics that occur when using CMP tools and pad/slurry consumables, as well as the surface mechanisms required for effective post-CMP cleaning. It also focuses on new successes and challenges in technologies such as electrochemical mechanical planarization (eCMP), three-dimensional integration and advanced CMP process modeling and control strategies.