Micro and Nanoscale Laser Processing of Hard Brittle Materials

Micro and Nanoscale Laser Processing of Hard Brittle Materials examines general laser-material interactions within this type of material, focusing on the nanoprocessing technologies that these phenomena have given rise to. Sections cover laser machining, healing, recovery, sintering, surface modification, texturing and microstructuring. These technologies all benefit from the characteristics of laser processing, its highly localized heating ability, and its well-defined optical properties. The book also describes frontier applications of the developed technologies, thus further emphasizing the possibility of processing hard brittle materials into complex structures with functional surfaces at both the micro and nanoscale. Provides readers with a solid understanding of laser-material interactions Helps readers choose suitable laser parameters for processing hard brittle materials Demonstrates how micro and nanoscale laser processing can be used to machine brittle materials without fracture

Over the past few decades, the rapid development of ultrafast lasers, such as femtosecond lasers and picosecond lasers, has opened up new avenues for material processing due to their unique features such as ultrashort pulse width and extremely high peak intensity. These techniques have become a common tool for micro- and nanoprocessing of a variety of materials and are now widely used for both fundamental researches and practical applications. This book is composed of 12 chapters covering relevant topics of ultrafast laser processing, including laser itself and novel beam manipulation methods for processing, fundamentals of ultrafast laser processing, nanomaterial synthesis, surface micro- and nanostructuring, micromachining, two-photon photopolymerization, internal modification/fabrication of transparent materials, applications to photonic devices and microchips for biological analysis, industrial applications, and so on. Each chapter is written by world-leading scientists in the related field so as to give comprehensive reviews in the field of ultrafast laser micro- and nanoprocessing.

The papers in this special volume represent the latest development in the field of materials manufacturing technology, spanning from the fundamentals to new technology and applications. Especially, the papers cover the topics of advanced manufacturing technology and equipment, material forming science and technology, digital manufacturing system and management, modern design theory and methodology, and MEMS and ultra precision manufacturing. Volume is indexed by Thomson Reuters CPCI-S (WoS).

This volume focuses on the state-of-the-art micro/nanofabrication technologies for creating miniature structures with high precision. These multidisciplinary technologies include mechanical, electrical, optical, physical, and chemical methods, as well as hybrid processes, covering subtractive and additive material manufacturing, as well as net-shape manufacturing. The materials the volume deals with include metals, alloys, semiconductors, polymers, crystals, glass, ceramics, composites, and nanomaterials. The volume is composed of 30 chapters, which are grouped into five parts. Engaging with the latest research in the field, these chapters provide important perspectives on key topics, from process developments at the shop level to scientific investigations at the academic level, offering both experimental work and theoretical analysis. Moreover, the content of this volume is highly interdisciplinary in nature, with insights from not only manufacturing technology but also mechanical/material science, optics, physics, chemistry, and more.

This book provides a systematic and comprehensive interdisciplinary overview of ductile mode cutting of brittle materials, covering a range of topics from the fundamental physics to engineering practices. Discussing the machining mechanics and material properties, it explains the fundamental mechanism of ductile-to-brittle transition in the cutting of brittle materials. It also presents theoretical modeling and molecular dynamic simulation to demonstrate that ductile mode cutting can be achieved under certain conditions, as well as extensive experimental studies that produced smooth and damage-free surfaces on different materials, such as silicon, glass, tungsten carbide and calcium fluoride. Lastly, it explores how the ductile mode cutting performance and machinability of brittle materials can be further improved by hybrid machining processes like ultrasonic vibration and thermal-assisted cutting technologies in order to meet industry demands.

Volume is indexed by Thomson Reuters CPCI-S (WoS). The objective of this special collection was to provide an excellent platform for updating and discussing the latest advances in precision engineering-related fields by researchers and engineers from research laboratories, academia and industry all over the world. The volume covers a wide gamut of topics in precision engineering-related fields, ranging over precision machining, advanced measurement techniques and green and sustainable manufacturing. This work will provide a stimulus and inspiration for future studies and advancement in precision engineering and manufacturing technologies.

Selected, peer reviewed papers from the 3rd International Conference on Advanced Engineering Materials and Technology (AEMT 2013), May 11-12, 2013, Zhangjiajie, China

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Vols. for 1970-71 includes manufacturers' catalogs.

This collection of selected peer-reviewed papers includes contributions from all over the world. The topics covered include new developments and applications in subtractive processes including advanced and non-traditional processes and abrasive machining, micro/nano-fabrication, material forming, and new techniques for the processing of materials and understanding the underlying principles of materials performance enhancement. This volume will be a valuable reference source for researchers in the materials processing field who wish to understand further the underlying mechanisms and this create new and practical technologies, systems and processes. It should also be particularly useful to practising engineers in materials processing who are responsible for providing efficient and effective operations.

The elements: Si, N, O, C and H, have strong chemical affinities for one another. Under the correct conditions, Si-N bonding will occur in almost any Si-N-(O/C/H), and many related, reaction systems; although Si-O and Si-C are formidable competitors to Si-N. The most favored Si-N compound is stoichiometric Si3N4. It comes in three common varieties: amorphous a-Si3N4 and crystalline ?-Si3N4 or ?-Si3N4. How they interrelate, how one finds them and (above all ) how one makes them - and how sometimes they just happen to form - are the subjects of this book, with due attention being paid to closely related matters.

Micro-Cutting: Fundamentals and Applicationscomprehensively covers the state of the art research andengineering practice in micro/nano cutting: an area which isbecoming increasingly important, especially in modernmicro-manufacturing, ultraprecision manufacturing and high valuemanufacturing. This book provides basic theory, design and analysis ofmicro-toolings and machines, modelling methods and techniques, andintegrated approaches for micro-cutting. The fundamentalcharacteristics, modelling, simulation and optimization ofmicro/nano cutting processes are emphasized with particularreference to the predictabilty, producibility, repeatability andproductivity of manufacturing at micro and nano scales. The fundamentals of micro/nano cutting are applied to a varietyof machining processes including diamond turning, micromilling,micro/nano grinding/polishing, ultraprecision machining, and thedesign and implementation of micro/nano cutting process chains andmicromachining systems. Key features • Contains contributions from leading global experts • Covers the fundamental theory of micro-cutting • Presents applications in a variety of machiningprocesses • Includes examples of how to implement and applymicro-cutting for precision and micro-manufacturing Micro-Cutting: Fundamentals and Applications is an idealreference for manufacturing engineers, production supervisors,tooling engineers, planning and application engineers, as well asmachine tool designers. It is also a suitable textbook forpostgraduate students in the areas of micro-manufacturing,micro-engineering and advanced manufacturing methods.

Increased demand for and developments in micromanufacturing have created a need for a resource that covers both the science and technology of this rapidly growing area. With contributions from eminent professors and researchers actively engaged in teaching, research, and development, Micromanufacturing Processes details the basic principles, tools,