Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
Author: Hal Greenhouse
Publsiher: William Andrew
Total Pages: 348
Release: 2011
ISBN 10: 1437778771
ISBN 13: 9781437778779
Language: EN, FR, DE, ES & NL

Hermeticity of Electronic Packages Book Review:

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the package�especially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journals�or only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today.

Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
Author: Hal Greenhouse,Robert Lowry,Bruce Romenesko
Publsiher: William Andrew Publishing
Total Pages: 366
Release: 2011-11
ISBN 10: 9780323165679
ISBN 13: 0323165672
Language: EN, FR, DE, ES & NL

Hermeticity of Electronic Packages Book Review:

This is a book about the integrity of sealed packages to resist foreign gases and liquids penetrating the seal or an opening (crack) in the packageuespecially critical to the reliability and longevity of electronics. The author explains how to predict the reliability and the longevity of the packages based on leak rate measurements and the assumptions of impurities. Non-specialists in particular will benefit from the author's long involvement in the technology. Hermeticity is a subject that demands practical experience, and solving one problem does not necessarily give one the background to solve another. Thus, the book provides a ready reference to help deal with day to day issues as they arise. The book gathers in a single volume a great many issues previously available only in journalsuor only in the experience of working engineers. How to define the ""goodness"" of a seal? How is that seal measured? How does the integrity of the seal affect circuit reliability? What is the significance of the measured integrity of the seal? What is the relationship of Residual Gas Analysis and the seal integrity? The handbook answers these questions and more, providing an analysis of nearly 100 problems representative of the wide variety of challenges that actually occur in industry today."

Hermeticity of Electronic Packages

Hermeticity of Electronic Packages
Author: Anonim
Publsiher: Unknown
Total Pages: 360
Release: 2011
ISBN 10:
ISBN 13: OCLC:756382481
Language: EN, FR, DE, ES & NL

Hermeticity of Electronic Packages Book Review:

Hermeticity Testing of MEMS and Microelectronic Packages

Hermeticity Testing of MEMS and Microelectronic Packages
Author: Suzanne Costello,Marc P.Y. Desmulliez
Publsiher: Artech House
Total Pages: 200
Release: 2013-10-01
ISBN 10: 1608075273
ISBN 13: 9781608075270
Language: EN, FR, DE, ES & NL

Hermeticity Testing of MEMS and Microelectronic Packages Book Review:

Packaging of microelectronics has been developing since the invention of the transistor in 1947. With the increasing complexity and decreasing size of the die, packaging requirements have continued to change. A step change in package requirements came with the introduction of the Micro-Electro-Mechanical System (MEMS) whereby interactions with the external environment are, in some cases, required. This resource is a rapid, definitive reference on hermetic packaging for the MEMS and microelectronics industry, giving practical guidance on traditional and newly developed test methods. This book includes up-to-date and applicable test methods for today’s package types. The authors cover the history and development of packaging, along with a view to understanding initial hermeticity testing requirements and the subsequent limitations of these methods when applied to new package types.

Electronic Packaging Materials and Their Properties

Electronic Packaging Materials and Their Properties
Author: Michael Pecht,Rakish Agarwal,F. Patrick McCluskey,Terrance J. Dishongh,Sirus Javadpour,Rahul Mahajan
Publsiher: CRC Press
Total Pages: 128
Release: 1998-12-18
ISBN 10: 9780849396250
ISBN 13: 0849396255
Language: EN, FR, DE, ES & NL

Electronic Packaging Materials and Their Properties Book Review:

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Handbook of Electronic Package Design

Handbook of Electronic Package Design
Author: Michael Pecht
Publsiher: CRC Press
Total Pages: 904
Release: 2018-10-24
ISBN 10: 1351838415
ISBN 13: 9781351838412
Language: EN, FR, DE, ES & NL

Handbook of Electronic Package Design Book Review:

Both a handbook for practitioners and a text for use in teaching electronic packaging concepts, guidelines, and techniques. The treatment begins with an overview of the electronics design process and proceeds to examine the levels of electronic packaging and the fundamental issues in the development

Electronic Packaging and Interconnection Handbook 4 E

Electronic Packaging and Interconnection Handbook 4 E
Author: Charles A. Harper
Publsiher: McGraw Hill Professional
Total Pages: 1000
Release: 2005
ISBN 10: 9780071430487
ISBN 13: 0071430482
Language: EN, FR, DE, ES & NL

Electronic Packaging and Interconnection Handbook 4 E Book Review:

Whether you're designing an electronic system from scratch or engineering the project from someone else's design, the Handbook gives you the tools you need to get the job done faster, cheaper and more reliably than ever. We guarantee it. From development and design to manufacturing and testing, the Handbook has you covered. It's the one resource to turn to first. Why not put it to the test and see for yourself?

Packaging and Embedded Electronics for the Next Generation

Packaging and Embedded Electronics for the Next Generation
Author: Michael J. Sampson,Nasa Technical Reports Server (Ntrs)
Publsiher: BiblioGov
Total Pages: 24
Release: 2013-07
ISBN 10: 9781289250560
ISBN 13: 1289250561
Language: EN, FR, DE, ES & NL

Packaging and Embedded Electronics for the Next Generation Book Review:

This viewgraph presentation describes examples of electronic packaging that protects an electronic element from handling, contamination, shock, vibration and light penetration. The use of Hermetic and non-hermetic packaging is also discussed. The topics include: 1) What is Electronic Packaging? 2) Why Package Electronic Parts? 3) Evolution of Packaging; 4) General Packaging Discussion; 5) Advanced non-hermetic packages; 6) Discussion of Hermeticity; 7) The Class Y Concept and Possible Extensions; 8) Embedded Technologies; and 9) NEPP Activities.

Area Array Interconnection Handbook

Area Array Interconnection Handbook
Author: Karl J. Puttlitz,Paul A. Totta
Publsiher: Springer Science & Business Media
Total Pages: 1188
Release: 2012-12-06
ISBN 10: 1461513898
ISBN 13: 9781461513896
Language: EN, FR, DE, ES & NL

Area Array Interconnection Handbook Book Review:

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has provided the necessary external wiring and interconnection capability for transistors and integrated circuits while they have gone through their own spectacular revolution from discrete device to gigascale integration. At IBM we are proud to have created the initial, simple concept of flip chip with solder bump connections at a time when a better way was needed to boost the reliability and improve the manufacturability of semiconductors. The basic design which was chosen for SLT (Solid Logic Technology) in the 1960s was easily extended to integrated circuits in the '70s and VLSI in the '80s and '90s. Three I/O bumps have grown to 3000 with even more anticipated for the future. The package families have evolved from thick-film (SLT) to thin-film (metallized ceramic) to co-fired multi-layer ceramic. A later family or ceramics with matching expansivity to sili con and copper internal wiring was developed as a predecessor of the chip interconnection revolution in copper, multilevel, submicron wiring. Powerful server packages have been de veloped in which the combined chip and package copper wiring exceeds a kilometer. All of this was achieved with the constant objective of minimizing circuit delays through short, efficient interconnects.

Reliability Abstracts and Technical Reviews

Reliability Abstracts and Technical Reviews
Author: United States. National Aeronautics and Space Administration. Office of Reliability and Quality Assurance
Publsiher: Unknown
Total Pages: 329
Release: 1968
ISBN 10:
ISBN 13: STANFORD:36105015617363
Language: EN, FR, DE, ES & NL

Reliability Abstracts and Technical Reviews Book Review:

Advances in Electronic Packaging

Advances in Electronic Packaging
Author: Anonim
Publsiher: Unknown
Total Pages: 329
Release: 1999
ISBN 10:
ISBN 13: UOM:39015048105640
Language: EN, FR, DE, ES & NL

Advances in Electronic Packaging Book Review:

Electronic Packaging and Production

Electronic Packaging and Production
Author: Anonim
Publsiher: Unknown
Total Pages: 329
Release: 1994
ISBN 10:
ISBN 13: UIUC:30112004383946
Language: EN, FR, DE, ES & NL

Electronic Packaging and Production Book Review:

Materials for High Temperature Semiconductor Devices

Materials for High Temperature Semiconductor Devices
Author: National Research Council,Division on Engineering and Physical Sciences,National Materials Advisory Board,Commission on Engineering and Technical Systems,Committee on Materials for High-Temperature Semiconductor Devices
Publsiher: National Academies Press
Total Pages: 136
Release: 1995-09-14
ISBN 10: 9780309176057
ISBN 13: 0309176050
Language: EN, FR, DE, ES & NL

Materials for High Temperature Semiconductor Devices Book Review:

Major benefits to system architecture would result if cooling systems for components could be eliminated without compromising performance. This book surveys the state-of-the-art for the three major wide bandgap materials (silicon carbide, nitrides, and diamond), assesses the national and international efforts to develop these materials, identifies the technical barriers to their development and manufacture, determines the criteria for successfully packaging and integrating these devices into existing systems, and recommends future research priorities.

Advanced Electronic Packaging

Advanced Electronic Packaging
Author: Richard K. Ulrich,William D. Brown
Publsiher: Wiley-IEEE Press
Total Pages: 840
Release: 2006-02-24
ISBN 10:
ISBN 13: STANFORD:36105114517258
Language: EN, FR, DE, ES & NL

Advanced Electronic Packaging Book Review:

As in the First Edition, each chapter in this new Second Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of the First Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Haleh Ardebili,Jiawei Zhang,Michael Pecht
Publsiher: William Andrew
Total Pages: 508
Release: 2018-10-23
ISBN 10: 0128119799
ISBN 13: 9780128119792
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Electronic Packaging Materials Science III Volume 108

Electronic Packaging Materials Science III  Volume 108
Author: Ralph Jaccodine,Kenneth A. Jackson,Robert C. Sundahl
Publsiher: Mrs Proceedings
Total Pages: 479
Release: 1988
ISBN 10:
ISBN 13: UOM:39015026950629
Language: EN, FR, DE, ES & NL

Electronic Packaging Materials Science III Volume 108 Book Review:

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

26th Electronic Components Conference

26th Electronic Components Conference
Author: Anonim
Publsiher: Unknown
Total Pages: 420
Release: 1976
ISBN 10:
ISBN 13: UCSD:31822025768201
Language: EN, FR, DE, ES & NL

26th Electronic Components Conference Book Review:

The International Journal of Microcircuits and Electronic Packaging

The International Journal of Microcircuits and Electronic Packaging
Author: Anonim
Publsiher: Unknown
Total Pages: 329
Release: 2000
ISBN 10:
ISBN 13: UOM:39015048294980
Language: EN, FR, DE, ES & NL

The International Journal of Microcircuits and Electronic Packaging Book Review:

MEMS A Practical Guide of Design Analysis and Applications

MEMS  A Practical Guide of Design  Analysis  and Applications
Author: Jan Korvink,Oliver Paul
Publsiher: Springer Science & Business Media
Total Pages: 965
Release: 2010-05-28
ISBN 10: 3540336559
ISBN 13: 9783540336556
Language: EN, FR, DE, ES & NL

MEMS A Practical Guide of Design Analysis and Applications Book Review:

A new generation of MEMS books has emerged with this cohesive guide on the design and analysis of micro-electro-mechanical systems (MEMS). Leading experts contribute to its eighteen chapters that encompass a wide range of innovative and varied applications. This publication goes beyond fabrication techniques covered by earlier books and fills a void created by a lack of industry standards. Subjects such as transducer operations and free-space microsystems are contained in its chapters. Satisfying a demand for literature on analysis and design of microsystems the book deals with a broad array of industrial applications. This will interest engineering and research scientists in industry and academia.

Application of Fracture Mechanics in Electronic Packaging and Materials

Application of Fracture Mechanics in Electronic Packaging and Materials
Author: Tien Y. Wu
Publsiher: Amer Society of Mechanical
Total Pages: 271
Release: 1995
ISBN 10:
ISBN 13: UOM:39015037285817
Language: EN, FR, DE, ES & NL

Application of Fracture Mechanics in Electronic Packaging and Materials Book Review:

Thirty-one technical papers representing a balance between university research and industrial practice, the results of which advance the quality and reliability of electronic products through fracture mechanics. Among the range of topics discussed at the symposium were: analytical and numerical anal