Handbook of Silicon Wafer Cleaning Technology

Handbook of Silicon Wafer Cleaning Technology
Author: Karen Reinhardt,Werner Kern
Publsiher: William Andrew
Total Pages: 760
Release: 2018-03-16
ISBN 10: 032351085X
ISBN 13: 9780323510851
Language: EN, FR, DE, ES & NL

Handbook of Silicon Wafer Cleaning Technology Book Review:

Handbook of Silicon Wafer Cleaning Technology, Third Edition, provides an in-depth discussion of cleaning, etching and surface conditioning for semiconductor applications. The fundamental physics and chemistry associated with wet and plasma processing are reviewed, including surface and colloidal aspects. This revised edition includes the developments of the last ten years to accommodate a continually involving industry, addressing new technologies and materials, such as germanium and III-V compound semiconductors, and reviewing the various techniques and methods for cleaning and surface conditioning. Chapters include numerous examples of cleaning technique and their results. The book helps the reader understand the process they are using for their cleaning application and why the selected process works. For example, discussion of the mechanism and physics of contamination, metal, particle and organic includes information on particle removal, metal passivation, hydrogen-terminated silicon and other processes that engineers experience in their working environment. In addition, the handbook assists the reader in understanding analytical methods for evaluating contamination. The book is arranged in an order that segments the various cleaning techniques, aqueous and dry processing. Sections include theory, chemistry and physics first, then go into detail for the various methods of cleaning, specifically particle removal and metal removal, amongst others. Focuses on cleaning techniques including wet, plasma and other surface conditioning techniques used to manufacture integrated circuits Reliable reference for anyone that manufactures integrated circuits or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process

Handbook of Semiconductor Wafer Cleaning Technology

Handbook of Semiconductor Wafer Cleaning Technology
Author: Werner Kern
Publsiher: William Andrew
Total Pages: 623
Release: 1993
ISBN 10:
ISBN 13: UOM:39015029095125
Language: EN, FR, DE, ES & NL

Handbook of Semiconductor Wafer Cleaning Technology Book Review:

"The cleaning of semiconductor wafers has become one of the most critical operations in the fabrication of semiconductor devices. The considerable body of technical and scientific literature is widely dispersed in numerous journals and symposia proceedings. This book brings together in one volume all pertinent knowledge on semiconductor wafer cleaning and its associated scientific and technical disciplines. It provides the first comprehensive and up-to-date coverage of this rapidly evolving field. Its thirteen chapters were written by nineteen scientists who are recognized experts in each topic." "The scope of this book is very broad, covering all aspects of wafer cleaning. Emphasis is on practical applications in the fab combined with authoritative scientific background information to provide a solid scientific basis for understanding the chemical and physical processes involved in cleaning and in the analytical methods of testing and evaluation." "The depth and breadth of the material should appeal to those new in the field as well as to experienced professionals. The volume is intended to serve as a handbook for practitioners and professionals in the field of semiconductor microelectronics, including fab engineers, scientists and technicians. It should also prove useful to manufacturers of processing equipment, persons concerned with contamination control and analysis, and students attending advanced or specialized technical courses."--BOOK JACKET.Title Summary field provided by Blackwell North America, Inc. All Rights Reserved

Handbook of Silicon Wafer Cleaning Technology

Handbook of Silicon Wafer Cleaning Technology
Author: Karen A. Reinhardt,Werner Kern
Publsiher: Noyes Publications
Total Pages: 718
Release: 2008
ISBN 10: 9780815515548
ISBN 13: 0815515545
Language: EN, FR, DE, ES & NL

Handbook of Silicon Wafer Cleaning Technology Book Review:

Now updated, this handbook addresses wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. It discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, and residue from wafer surfaces.

Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies
Author: Markku Tilli,Mervi Paulasto-Krockel,Veli-Matti Airaksinen,Sami Franssila,Veikko Lindroos,Ari Lehto,Teruaki Motooka
Publsiher: Elsevier
Total Pages: 668
Release: 2009-12-08
ISBN 10: 9780815519881
ISBN 13: 0815519885
Language: EN, FR, DE, ES & NL

Handbook of Silicon Based MEMS Materials and Technologies Book Review:

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Handbook of Silicon Wafer Cleaning Technology 2nd Edition

Handbook of Silicon Wafer Cleaning Technology  2nd Edition
Author: Karen Reinhardt,Werner Kern
Publsiher: William Andrew
Total Pages: 660
Release: 2008-12-10
ISBN 10: 0815517734
ISBN 13: 9780815517733
Language: EN, FR, DE, ES & NL

Handbook of Silicon Wafer Cleaning Technology 2nd Edition Book Review:

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol

Ultraclean Surface Processing of Silicon Wafers

Ultraclean Surface Processing of Silicon Wafers
Author: Takeshi Hattori
Publsiher: Springer Science & Business Media
Total Pages: 616
Release: 2013-03-09
ISBN 10: 3662035359
ISBN 13: 9783662035351
Language: EN, FR, DE, ES & NL

Ultraclean Surface Processing of Silicon Wafers Book Review:

A totally new concept for clean surface processing of Si wafers is introduced in this book. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Handbook for Cleaning for Semiconductor Manufacturing

Handbook for Cleaning for Semiconductor Manufacturing
Author: Karen A. Reinhardt,Richard F. Reidy
Publsiher: Wiley-Scrivener
Total Pages: 590
Release: 2011-01-11
ISBN 10: 9780470625958
ISBN 13: 0470625953
Language: EN, FR, DE, ES & NL

Handbook for Cleaning for Semiconductor Manufacturing Book Review:

This comprehensive volume provides an in-depth discussion of the fundamentals of cleaning and surface conditioning of semiconductor applications such as high-k/metal gate cleaning, copper/low-k cleaning, high dose implant stripping, and silicon and SiGe passivation. The theory and fundamental physics associated with wet etching and wet cleaning is reviewed, plus the surface and colloidal aspects of wet processing. Formulation development practices and methodology are presented along with the applications for preventing copper corrosion, cleaning aluminum lines, and other sensitive layers. This is a must-have reference for any engineer or manager associated with using or supplying cleaning and contamination free technologies for semiconductor manufacturing. From the Reviews... "This handbook will be a valuable resource for many academic libraries. Many engineering librarians who work with a variety of programs (including, but not limited to Materials Engineering) should include this work in their collection. My recommendation is to add this work to any collection that serves a campus with a materials/manufacturing/electrical/computer engineering programs and campuses with departments of physics and/or chemistry with large graduate-level enrollment." —Randy Wallace, Department Head, Discovery Park Library, University of North Texas

Handbook of Semiconductor Manufacturing Technology

Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi,Robert Doering
Publsiher: CRC Press
Total Pages: 1720
Release: 2017-12-19
ISBN 10: 1351829823
ISBN 13: 9781351829823
Language: EN, FR, DE, ES & NL

Handbook of Semiconductor Manufacturing Technology Book Review:

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Semiconductor Manufacturing Handbook

Semiconductor Manufacturing Handbook
Author: Hwaiyu Geng
Publsiher: McGraw Hill Professional
Total Pages: 800
Release: 2005-04-27
ISBN 10: 0071445595
ISBN 13: 9780071445597
Language: EN, FR, DE, ES & NL

Semiconductor Manufacturing Handbook Book Review:

This handbook will provide engineers with the principles, applications, and solutions needed to design and manage semiconductor manufacturing operations. Consolidating the many complex fields of semiconductor fundamentals and manufacturing into one volume by deploying a team of world class specialists, it allows the quick look up of specific manufacturing reference data across many subdisciplines.

Handbook of Semiconductor Interconnection Technology

Handbook of Semiconductor Interconnection Technology
Author: Geraldine Cogin Shwartz
Publsiher: CRC Press
Total Pages: 536
Release: 2006-02-22
ISBN 10: 1420017659
ISBN 13: 9781420017656
Language: EN, FR, DE, ES & NL

Handbook of Semiconductor Interconnection Technology Book Review:

First introduced about a decade ago, the first edition of the Handbook of Semiconductor Interconnection Technology became widely popular for its thorough, integrated treatment of interconnect technologies and its forward-looking perspective. The field has grown tremendously in the interim and many of the "likely directions" outlined in the first ed

Handbook of Sputter Deposition Technology

Handbook of Sputter Deposition Technology
Author: Kiyotaka Wasa,Isaku Kanno,Hidetoshi Kotera
Publsiher: William Andrew
Total Pages: 644
Release: 2012
ISBN 10: 1437734839
ISBN 13: 9781437734836
Language: EN, FR, DE, ES & NL

Handbook of Sputter Deposition Technology Book Review:

Sputtering is a Physical Vapor Deposition vacuum process used to deposit very thin films onto a substrate for a wide variety of commercial and scientific purposes. Sputtering occurs when an ionized gas molecule is used to displace atoms of a specific material. These atoms then bond at the atomic level to a substrate and create a thin film. Several types of sputtering processes exist, including: ion beam, diode, and magnetron sputtering. Cathode sputtering is widely used in the microelectronics industry for silicon integrated circuit production and for metallic coatings. High temperature, diamond films and ferroelectric materials are other applications. Sputtering applications are important across a wide range of industries, including the automotive, medical, semiconductors, space, plastics, and military sectors. A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available. All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique. 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere.

Handbook of Semiconductor Silicon Technology

Handbook of Semiconductor Silicon Technology
Author: William C. O'Mara,Robert B. Herring,Lee P. Hunt
Publsiher: William Andrew
Total Pages: 795
Release: 1990
ISBN 10:
ISBN 13: UOM:39015018468192
Language: EN, FR, DE, ES & NL

Handbook of Semiconductor Silicon Technology Book Review:

A summary of the science, technology, and manufacturing of semiconductor silicon materials. Properties of silicon are detailed, and a set of silicon binary phase diagrams is included. Other aspects such as materials handling, safety, impurity, and defect reduction are also discussed.

Handbook of Photovoltaic Silicon

Handbook of Photovoltaic Silicon
Author: Deren Yang
Publsiher: Unknown
Total Pages: 329
Release: 2019
ISBN 10: 9783662527351
ISBN 13: 3662527359
Language: EN, FR, DE, ES & NL

Handbook of Photovoltaic Silicon Book Review:

"Updated content will continue to be published as 'Living Reference Works'"--Publisher.

Handbook of Wafer Bonding

Handbook of Wafer Bonding
Author: Peter Ramm,James Jian-Qiang Lu,Maaike M. V. Taklo
Publsiher: John Wiley & Sons
Total Pages: 395
Release: 2012-02-13
ISBN 10: 3527326464
ISBN 13: 9783527326464
Language: EN, FR, DE, ES & NL

Handbook of Wafer Bonding Book Review:

The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.

Handbook of Advanced Plasma Processing Techniques

Handbook of Advanced Plasma Processing Techniques
Author: R.J. Shul,S.J. Pearton
Publsiher: Springer Science & Business Media
Total Pages: 655
Release: 2011-06-28
ISBN 10: 3642569897
ISBN 13: 9783642569890
Language: EN, FR, DE, ES & NL

Handbook of Advanced Plasma Processing Techniques Book Review:

Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.

Semiconductor Safety Handbook

Semiconductor Safety Handbook
Author: Richard A. Bolmen
Publsiher: William Andrew
Total Pages: 634
Release: 1998-12-31
ISBN 10: 0815518994
ISBN 13: 9780815518990
Language: EN, FR, DE, ES & NL

Semiconductor Safety Handbook Book Review:

Interwoven within our semiconductor technology development had been the development of technologies aimed at identifying, evaluating and mitigating the environmental, health and safety (EH&S) risks and exposures associated with the manufacturing and packaging of integrated circuits. Driving and advancing these technologies have been international efforts by SEMI's Safety Division, the Semiconductor Safety Association (SSA), and the Semiconductor Industry Association (SIA). The purpose of the Semiconductor Safety Handbook is to provide a current, single source reference for many of the primary semiconductor EH&S technologies and disciplines. To this end, the contributors have assembled a comprehensive text written by some of the leading experts in EH&S in the semiconductor industry. This text had taken three years to complete and has involved tremendous effort and commitment by the authors. They have attempted to construct a reference manual that is comprehensive in its coverage of the technical aspects of each individual subject, while at the same time addressing practical applications of each topic. The scope of this text, from its inception, was intended to address significantly more than what would typically be classified under the definition of ""safety."" However, all of the chapters have a direct application to the protection and preservation of semiconductor employees, the surrounding communities and the environment. This book is a hands-on reference to environmental, health and safety issues critical to the semiconductor industry. It was also the author's intent to produce a text that provides a practical user's guide for semiconductor environmental, health and safety practitioners as well as those individuals responsible for operation, maintenance and production in wafer fabrication facilities.

Surface Contamination and Cleaning

Surface Contamination and Cleaning
Author: Kash L. Mittal
Publsiher: CRC Press
Total Pages: 364
Release: 2003-03-01
ISBN 10: 9047403282
ISBN 13: 9789047403289
Language: EN, FR, DE, ES & NL

Surface Contamination and Cleaning Book Review:

This volume documents the proceedings of the International Symposium on Surface Contamination and Cleaning, held in Newark, New Jersey, May 23-25, 2001. Because of the importance of this topic in many technological areas, tremendous efforts have been devoted to devise novel and more efficient ways to monitor, analyse and characterize contamination

Handbook of Silicon Wafer Cleaning Technology 2nd Edition

Handbook of Silicon Wafer Cleaning Technology  2nd Edition
Author: Karen Reinhardt,Werner Kern
Publsiher: William Andrew
Total Pages: 660
Release: 2008-12-10
ISBN 10: 9780815517733
ISBN 13: 0815517734
Language: EN, FR, DE, ES & NL

Handbook of Silicon Wafer Cleaning Technology 2nd Edition Book Review:

The second Edition of the Handbook of Silicon Wafer Cleaning Technology is intended to provide knowledge of wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits. The integration of the clean processes into the device manufacturing flow will be presented with respect to other manufacturing steps such as thermal, implant, etching, and photolithography processes. The Handbook discusses both wet and plasma-based cleaning technologies that are used for removing contamination, particles, residue, and photoresist from wafer surfaces. Both the process and the equipment are covered. A review of the current cleaning technologies is included. Also, advanced cleaning technologies that are under investigation for next generation processing are covered; including supercritical fluid, laser, and cryoaerosol cleaning techniques. Additionally theoretical aspects of the cleaning technologies and how these processes affect the wafer is discussed such as device damage and surface roughening will be discussed. The analysis of the wafers surface is outlined. A discussion of the new materials and the changes required for the surface conditioning process used for manufacturing is also included. Focused on silicon wafer cleaning techniques including wet, plasma, and other surface conditioning techniques used to manufacture integrated circuits As this book covers the major technologies for removing contaminants, it is a reliable reference for anyone that manufactures integrated circuits, or supplies the semiconductor and microelectronics industries Covers processes and equipment, as well as new materials and changes required for the surface conditioning process Editors are two of the top names in the field and are both extensively published Discusses next generation processing techniques including supercritical fluid, laser, and cryoaerosol

Handbook of 3D Integration Volume 3

Handbook of 3D Integration  Volume 3
Author: Philip Garrou,Mitsumasa Koyanagi,Peter Ramm
Publsiher: John Wiley & Sons
Total Pages: 474
Release: 2014-04-22
ISBN 10: 3527670122
ISBN 13: 9783527670123
Language: EN, FR, DE, ES & NL

Handbook of 3D Integration Volume 3 Book Review:

Edited by key figures in 3D integration and written by top authors from high-tech companies and renowned research institutions, this book covers the intricate details of 3D process technology. As such, the main focus is on silicon via formation, bonding and debonding, thinning, via reveal and backside processing, both from a technological and a materials science perspective. The last part of the book is concerned with assessing and enhancing the reliability of the 3D integrated devices, which is a prerequisite for the large-scale implementation of this emerging technology. Invaluable reading for materials scientists, semiconductor physicists, and those working in the semiconductor industry, as well as IT and electrical engineers.

Handbook of Silicon Photonics

Handbook of Silicon Photonics
Author: Laurent Vivien,Lorenzo Pavesi
Publsiher: Taylor & Francis
Total Pages: 851
Release: 2016-04-19
ISBN 10: 1439836116
ISBN 13: 9781439836118
Language: EN, FR, DE, ES & NL

Handbook of Silicon Photonics Book Review:

The development of integrated silicon photonic circuits has recently been driven by the Internet and the push for high bandwidth as well as the need to reduce power dissipation induced by high data-rate signal transmission. To reach these goals, efficient passive and active silicon photonic devices, including waveguide, modulators, photodetectors,