Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Haleh Ardebili,Michael Pecht
Publsiher: William Andrew
Total Pages: 504
Release: 2009-07-22
ISBN 10: 9780815519706
ISBN 13: 0815519702
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Coverage of environmentally friendly 'green encapsulants' Practical coverage of faults and defects: how to analyze them and how to avoid them

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Haleh Ardebili,Jiawei Zhang,Michael Pecht
Publsiher: William Andrew
Total Pages: 508
Release: 2018-10-23
ISBN 10: 0128119799
ISBN 13: 9780128119792
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Jiawei Zhang,Haleh Ardebili,Michael Pecht
Publsiher: Mosby Limited
Total Pages: 550
Release: 2018-05
ISBN 10: 9780128119785
ISBN 13: 0128119780
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Printed Electronics

Printed Electronics
Author: Zheng Cui
Publsiher: John Wiley & Sons
Total Pages: 450
Release: 2016-09-26
ISBN 10: 1118920929
ISBN 13: 9781118920923
Language: EN, FR, DE, ES & NL

Printed Electronics Book Review:

This book provides an overview of the newly emerged and highly interdisciplinary field of printed electronics • Provides an overview of the latest developments and research results in the field of printed electronics • Topics addressed include: organic printable electronic materials, inorganic printable electronic materials, printing processes and equipments for electronic manufacturing, printable transistors, printable photovoltaic devices, printable lighting and display, encapsulation and packaging of printed electronic devices, and applications of printed electronics • Discusses the principles of the above topics, with support of examples and graphic illustrations • Serves both as an advanced introductory to the topic and as an aid for professional development into the new field • Includes end of chapter references and links to further reading

Encapsulation and Controlled Release Technologies in Food Systems

Encapsulation and Controlled Release Technologies in Food Systems
Author: Jamileh M. Lakkis
Publsiher: John Wiley & Sons
Total Pages: 408
Release: 2016-04-18
ISBN 10: 1118733525
ISBN 13: 9781118733523
Language: EN, FR, DE, ES & NL

Encapsulation and Controlled Release Technologies in Food Systems Book Review:

The emergence of the discipline of encapsulation and controlled release has had a great impact on the food and dietary supplements sectors; principally around fortifying food systems with nutrients and health-promoting ingredients. The successful incorporation of these actives in food formulations depends on preserving their stability and bioavailability as well as masking undesirable flavors throughout processing, shelf life and consumption. This second edition of Encapsulation and Controlled Release Technologies in Food Systems serves as an improvement and a complement companion to the first. However, it differentiates itself in two main aspects. Firstly, it introduces the reader to novel encapsulation and controlled release technologies which have not yet been addressed by any existing book on this matter, and secondly, it offers an in-depth discussion on the impact of encapsulation and controlled release technologies on the bioavailability of health ingredients and other actives. In common with the first edition the book includes chapters written by distinguished authors and researchers in their respective areas of specialization. This book is designed as a reference for scientists and formulators in the food, nutraceuticals and consumer products industries who are looking to formulate new or existing products using microencapsulated ingredients. It is also a post-graduate text designed to provide students with an introduction to encapsulation and controlled release along with detailed coverage of various encapsulation technologies and their adaptability to specific applications.

Microencapsulation

Microencapsulation
Author: Bartosz Tylkowski,Marta Giamberini,Susana Fernandez Prieto
Publsiher: Walter de Gruyter GmbH & Co KG
Total Pages: 320
Release: 2020-04-06
ISBN 10: 3110642077
ISBN 13: 9783110642070
Language: EN, FR, DE, ES & NL

Microencapsulation Book Review:

Microencapsulations may be found in a number of fields like medicine, drug delivery, biosensing, agriculture, catalysis, intelligent microstructures and in many consumer goods. This new edition of Microencapsulation revises chapters to address the newest innovations in fields and adds three new chapters on the uses of microencapsulations in medicine, agriculture, and consumer products.

Organic and Printed Electronics

Organic and Printed Electronics
Author: Giovanni Nisato,Donald Lupo,Simone Ganz
Publsiher: CRC Press
Total Pages: 604
Release: 2016-04-27
ISBN 10: 981466975X
ISBN 13: 9789814669757
Language: EN, FR, DE, ES & NL

Organic and Printed Electronics Book Review:

The field of organic and printed electronics is well established in terms of academic, scientific, and technological research but is still an emerging one in terms of mass industrial applications such as OLED displays and lighting and organic photovoltaics. This book provides a comprehensive introduction to organic and printed electronics, their fundamental aspects, core technologies, and applications, and it is the first book of its kind specifically designed to address students in their final undergraduate or beginning graduate studies, as well as engineers interested in approaching this field.

Encapsulation Technologies and Delivery Systems for Food Ingredients and Nutraceuticals

Encapsulation Technologies and Delivery Systems for Food Ingredients and Nutraceuticals
Author: Nissim Garti,D. Julian McClements
Publsiher: Elsevier
Total Pages: 640
Release: 2012-10-19
ISBN 10: 0857095900
ISBN 13: 9780857095909
Language: EN, FR, DE, ES & NL

Encapsulation Technologies and Delivery Systems for Food Ingredients and Nutraceuticals Book Review:

Improved technologies for the encapsulation, protection, release and enhanced bioavailability of food ingredients and nutraceutical components are vital to the development of future foods. Encapsulation technologies and delivery systems for food ingredients and nutraceuticals provides a comprehensive guide to current and emerging techniques. Part one provides an overview of key requirements for food ingredient and nutraceutical delivery systems, discussing challenges in system development and analysis of interaction with the human gastrointestinal tract. Processing technologies for encapsulation and delivery systems are the focus of part two. Spray drying, cooling and chilling are reviewed alongside coextrusion, fluid bed microencapsulation, microencapsulation methods based on biopolymer phase separation, and gelation phenomena in aqueous media. Part three goes on to investigate physicochemical approaches to the production of encapsulation and delivery systems, including the use of micelles and microemulsions, polymeric amphiphiles, liposomes, colloidal emulsions, organogels and hydrogels. Finally, part four reviews characterization and applications of delivery systems, providing industry perspectives on flavour, fish oil, iron micronutrient and probiotic delivery systems. With its distinguished editors and international team of expert contributors, Encapsulation technologies and delivery systems for food ingredients and nutraceuticals is an authoritative guide for both industry and academic researchers interested in encapsulation and controlled release systems. Provides a comprehensive guide to current and emerging techniques in encapsulation technologies and delivery systems Chapters in part one provide an overview of key requirements for food ingredient and nutraceutical delivery systems, while part two discusses processing technologies for encapsulation and delivery systems Later sections investigate physicochemical approaches to the production of encapsulation and delivery systems and review characterization and applications of delivery systems

Microencapsulation in the Food Industry

Microencapsulation in the Food Industry
Author: Anilkumar G. Gaonkar,Niraj Vasisht,Atul R. Khare,Robert Sobel
Publsiher: Elsevier
Total Pages: 590
Release: 2014-06-30
ISBN 10: 0124047351
ISBN 13: 9780124047358
Language: EN, FR, DE, ES & NL

Microencapsulation in the Food Industry Book Review:

Microencapsulation is being used to deliver everything from improved nutrition to unique consumer sensory experiences. It’s rapidly becoming one of the most important opportunities for expanding brand potential. Microencapsulation in the Food Industry: A Practical Implementation Guide is written for those who see the potential benefit of using microencapsulation but need practical insight into using the technology. With coverage of the process technologies, materials, testing, regulatory and even economic insights, this book presents the key considerations for putting microencapsulation to work. Application examples as well as online access to published and issued patents provide information on freedom to operate, building an intellectual property portfolio, and leveraging ability into potential in licensing patents to create produce pipeline. This book bridges the gap between fundamental research and application by combining the knowledge of new and novel processing techniques, materials and selection, regulatory concerns, testing and evaluation of materials, and application-specific uses of microencapsulation. Practical applications based on the authors’ more than 50 years combined industry experience Focuses on application, rather than theory Includes the latest in processes and methodologies Provides multiple "starting point" options to jump-start encapsulation use

Nitride Semiconductor Light Emitting Diodes LEDs

Nitride Semiconductor Light Emitting Diodes  LEDs
Author: Jian-Jang Huang,Hao-Chung Kuo,Shyh-Chiang Shen
Publsiher: Woodhead Publishing
Total Pages: 650
Release: 2014-02-14
ISBN 10: 0857099302
ISBN 13: 9780857099303
Language: EN, FR, DE, ES & NL

Nitride Semiconductor Light Emitting Diodes LEDs Book Review:

The development of nitride-based light-emitting diodes (LEDs) has led to advancements in high-brightness LED technology for solid-state lighting, handheld electronics, and advanced bioengineering applications. Nitride Semiconductor Light-Emitting Diodes (LEDs) reviews the fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations. Part one reviews the fabrication of nitride semiconductor LEDs. Chapters cover molecular beam epitaxy (MBE) growth of nitride semiconductors, modern metalorganic chemical vapor deposition (MOCVD) techniques and the growth of nitride-based materials, and gallium nitride (GaN)-on-sapphire and GaN-on-silicon technologies for LEDs. Nanostructured, non-polar and semi-polar nitride-based LEDs, as well as phosphor-coated nitride LEDs, are also discussed. Part two covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots. Further chapters discuss the development of LED encapsulation technology and the fundamental efficiency droop issues in gallium indium nitride (GaInN) LEDs. Finally, part three highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infrared emitters, and automotive lighting. Nitride Semiconductor Light-Emitting Diodes (LEDs) is a technical resource for academics, physicists, materials scientists, electrical engineers, and those working in the lighting, consumer electronics, automotive, aviation, and communications sectors. Reviews fabrication, performance, and applications of this technology that encompass the state-of-the-art material and device development, and practical nitride-based LED design considerations Covers the performance of nitride LEDs, including photonic crystal LEDs, surface plasmon enhanced LEDs, color tuneable LEDs, and LEDs based on quantum wells and quantum dots Highlights applications of nitride LEDs, including liquid crystal display (LCD) backlighting, infra-red emitters, and automotive lighting

Spray Drying Techniques for Food Ingredient Encapsulation

Spray Drying Techniques for Food Ingredient Encapsulation
Author: C. Anandharamakrishnan,Padma Ishwarya S.
Publsiher: John Wiley & Sons
Total Pages: 312
Release: 2015-07-23
ISBN 10: 1118864271
ISBN 13: 9781118864272
Language: EN, FR, DE, ES & NL

Spray Drying Techniques for Food Ingredient Encapsulation Book Review:

Spray drying is a well-established method for transforming liquid materials into dry powder form. Widely used in the food and pharmaceutical industries, this technology produces high quality powders with low moisture content, resulting in a wide range of shelf stable food and other biologically significant products. Encapsulation technology for bioactive compounds has gained momentum in the last few decades and a series of valuable food compounds, namely flavours, carotenoids and microbial cells have been successfully encapsulated using spray drying. Spray Drying Technique for Food Ingredient Encapsulation provides an insight into the engineering aspects of the spray drying process in relation to the encapsulation of food ingredients, choice of wall materials, and an overview of the various food ingredients encapsulated using spray drying. The book also throws light upon the recent advancements in the field of encapsulation by spray drying, i.e., nanospray dryers for production of nanocapsules and computational fluid dynamics (CFD) modeling. Addressing the basics of the technology and its applications, the book will be a reference for scientists, engineers and product developers in the industry.

Advances in Micro Nano Electromechanical Systems and Fabrication Technologies

Advances in Micro Nano Electromechanical Systems and Fabrication Technologies
Author: Kenichi Takahata
Publsiher: BoD – Books on Demand
Total Pages: 236
Release: 2013-05-29
ISBN 10: 9535110853
ISBN 13: 9789535110859
Language: EN, FR, DE, ES & NL

Advances in Micro Nano Electromechanical Systems and Fabrication Technologies Book Review:

MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.

Handbook of Flexible Organic Electronics

Handbook of Flexible Organic Electronics
Author: Stergios Logothetidis
Publsiher: Elsevier
Total Pages: 478
Release: 2014-12-15
ISBN 10: 1782420436
ISBN 13: 9781782420439
Language: EN, FR, DE, ES & NL

Handbook of Flexible Organic Electronics Book Review:

Organic flexible electronics represent a highly promising technology that will provide increased functionality and the potential to meet future challenges of scalability, flexibility, low power consumption, light weight, and reduced cost. They will find new applications because they can be used with curved surfaces and incorporated in to a number of products that could not support traditional electronics. The book covers device physics, processing and manufacturing technologies, circuits and packaging, metrology and diagnostic tools, architectures, and systems engineering. Part one covers the production, properties and characterisation of flexible organic materials and part two looks at applications for flexible organic devices. Reviews the properties and production of various flexible organic materials. Describes the integration technologies of flexible organic electronics and their manufacturing methods. Looks at the application of flexible organic materials in smart integrated systems and circuits, chemical sensors, microfluidic devices, organic non-volatile memory devices, and printed batteries and other power storage devices.

Handbook of Silicon Based MEMS Materials and Technologies

Handbook of Silicon Based MEMS Materials and Technologies
Author: Markku Tilli,Mervi Paulasto-Krockel,Veli-Matti Airaksinen,Sami Franssila,Veikko Lindroos,Ari Lehto,Teruaki Motooka
Publsiher: Elsevier
Total Pages: 668
Release: 2009-12-08
ISBN 10: 9780815519881
ISBN 13: 0815519885
Language: EN, FR, DE, ES & NL

Handbook of Silicon Based MEMS Materials and Technologies Book Review:

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications. Key topics covered include: Silicon as MEMS material Material properties and measurement techniques Analytical methods used in materials characterization Modeling in MEMS Measuring MEMS Micromachining technologies in MEMS Encapsulation of MEMS components Emerging process technologies, including ALD and porous silicon Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities. Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland. Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland. Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland. Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

Green Materials for Electronics

Green Materials for Electronics
Author: Mihai Irimia-Vladu,Eric D. Glowacki,Niyazi S. Sariciftci,Siegfried Bauer
Publsiher: John Wiley & Sons
Total Pages: 206
Release: 2017-09-04
ISBN 10: 3527692967
ISBN 13: 9783527692965
Language: EN, FR, DE, ES & NL

Green Materials for Electronics Book Review:

Combining the materials science, technological, and device aspects of organic bioelectronics based on green materials, this is the first overview of the emerging concepts involving fabrication techniques for sustainable electronics with low energy and material consumption. With contributions from top-notch editors and authors, in one focus, the book covers a collection of natural materials suited for electronics applications such as paper, silk, melanin, DNA and nucleobases, resins, gums, saccharides, cellulose, gelatine and peptides. In another thrust, the book focuses on device fabrication based on these materials, including processing aspects, and applications such as sensors, signal transducers, transient, implantable and digestible electronics. With its interdisciplinary approach this text will appeal to the chemistry, physics, materials science, and engineering communities.

Polymers for Electronic Photonic Application

Polymers for Electronic   Photonic Application
Author: C. P. Wong
Publsiher: Elsevier
Total Pages: 661
Release: 2013-10-22
ISBN 10: 1483289397
ISBN 13: 9781483289397
Language: EN, FR, DE, ES & NL

Polymers for Electronic Photonic Application Book Review:

The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This book provides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging, electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacture microelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments in this field. * Presents most recent advances in the use of polymeric materials by the electronic industry * Contributions by foremost experts in the field

Applications of Encapsulation and Controlled Release

Applications of Encapsulation and Controlled Release
Author: Munmaya K. Mishra
Publsiher: CRC Press
Total Pages: 474
Release: 2019-09-18
ISBN 10: 1000576647
ISBN 13: 9781000576641
Language: EN, FR, DE, ES & NL

Applications of Encapsulation and Controlled Release Book Review:

The field of encapsulation, especially microencapsulation, is a rapidly growing area of research and product development. Applications of Encapsulation and Controlled Release offers a broad perspective on a variety of applications and processes, including, up-to-date research, figures, tables, illustrations, and references. Written at a level comprehensible to non-experts, it is a rich source of technical information and current practices in research and industry.

Encapsulation Technologies for Active Food Ingredients and Food Processing

Encapsulation Technologies for Active Food Ingredients and Food Processing
Author: N.J. Zuidam,Viktor Nedovic
Publsiher: Springer Science & Business Media
Total Pages: 400
Release: 2009-10-30
ISBN 10: 9781441910080
ISBN 13: 1441910085
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Active Food Ingredients and Food Processing Book Review:

Consumers prefer food products that are tasty, healthy, and convenient. Encapsulation is an important way to meet these demands by delivering food ingredients at the right time and right place. For example, encapsulates may allow flavor retention, mask bad tasting or bad smelling components, stabilize food ingredients, and increase their bioavailability. Encapsulation may also be used to immobilize cells or enzymes in the production of food materials or products, such as fermentation or metabolite production. This book provides a detailed overview of the encapsulation technologies available for use in food products, food processing, and food production. The book aims to inform those who work in academia or R&D about both the delivery of food compounds via encapsulation and food processing using immobilized cells or enzymes. The structure of the book is according to the use of encapsulates for a specific application. Emphasis is placed on strategy, since encapsulation technologies may change. Most chapters include application possibilities of the encapsulation technologies in specific food products or processes. The first part of the book reviews general technologies, food-grade materials, and characterization methods for encapsulates. The second part discusses encapsulates of active ingredients (e.g., aroma, fish oil, minerals, vitamins, peptides, proteins, probiotics) for specific food applications. The last part describes immobilization technologies of cells and enzymes for use within food fermentation processes (e.g., beer, wine, dairy, meat), and food production (e.g., sugar conversion, production of organic acids or amino acids, hydrolysis of triglycerides). Edited by two leading experts in the field, Encapsulation Technologies for Food Active Ingredients and Food Processing will be a valuable reference source for those working in the academia or food industry. The editors work in both industry or academia, and they have brought together in this book contributions from both fields.

New Polymers for Encapsulation of Nutraceutical Compounds

New Polymers for Encapsulation of Nutraceutical Compounds
Author: Jorge Carlos Ruiz Ruiz,Maira Rubi Segura Campos
Publsiher: John Wiley & Sons
Total Pages: 352
Release: 2017-01-24
ISBN 10: 1119228794
ISBN 13: 9781119228790
Language: EN, FR, DE, ES & NL

New Polymers for Encapsulation of Nutraceutical Compounds Book Review:

The incorporation of functional ingredients in a given food system and the processing and handling of such foods are associated with nutritional challenges for their healthy delivery. The extreme sensitivity of some components cause significant loss of product quality, stability, nutritional value and bioavailability, and the overall acceptability of the food product. Consequently, encapsulation has been successfully used to improve stability and bioavailability of functional ingredients. Encapsulation is one example of technology that has the potential to meet the challenge of successfully incorporating and delivering functional ingredients into a range of food types. The book will cover topics about 1) Characterization of novel polymers and their use in encapsulation processes. 2) Stability of nutraceutical compounds encapsulated with novel polymers. 3) Application of encapsulated compounds with novel polymers in functional food systems. This book provides a detailed overview of technologies for preparing and characterisation of encapsulates for food active ingredients using modified polymers. The use of modified polymers as coating materials it is a field that still needs study. The book is aimed to inform students and researchers in the areas of food science and food technology, and professionals in the food industry.

Printed Batteries

Printed Batteries
Author: Senentxu Lanceros-Méndez,Carlos Miguel Costa
Publsiher: John Wiley & Sons
Total Pages: 264
Release: 2018-04-23
ISBN 10: 1119287421
ISBN 13: 9781119287421
Language: EN, FR, DE, ES & NL

Printed Batteries Book Review:

Printed batteries : an overview / J. Oliveira, C.M. Costa, S. Lanceros-Méndez -- Printing techniques for batteries / A. Willert, A.-T. Tran-Le, K.Y. Mitra, M. Clair, C.M. Costa, S. Lanceros-Méndez, R.R. Baumann -- The influence of slurry rheology on lithium-ion electrode processing / T.-J. Liu, C. Tiu, L.-C. Chen, D. Liu -- Polymer electrolytes for printed batteries / E. Strauss, S. Menkin, D. Golodnitsky -- Design of printed batteries : from chemistry to aesthetics / K.-H. Choi, S.-Y. Lee -- Applications of printed batteries / A.M. Gaikwad, A.E. Ostfeld, A.C. Arias -- Industrial perspective on printed batteries / P. Rassek, M. Wendler, M. Krebs -- Open questions, challenges and outlook / C.M. Costa, J. Oliveira, S. Lanceros-Méndez