Advances in CMP polishing Technologies for the Manufacture of Electronic Devices

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices
Author: Toshiro Doi,Ioan D. Marinescu,Syuhei Kurokawa
Publsiher: William Andrew
Total Pages: 317
Release: 2011-12
ISBN 10: 1437778593
ISBN 13: 9781437778595
Language: EN, FR, DE, ES & NL

Advances in CMP polishing Technologies for the Manufacture of Electronic Devices Book Review:

CMP and polishing are the most precise processes used to finish the surfaces of mechanical and electronic or semiconductor components. Advances in CMP/Polishing Technologies for Manufacture of Electronic Devices presents the latest developments and technological innovations in the field - making cutting-edge R&D accessible to the wider engineering community. Most of the applications of these processes are kept as confidential as possible (proprietary information), and specific details are not seen in professional or technical journals and magazines. This book makes these processes and applications accessible to a wider industrial and academic audience. Building on the fundamentals of tribology - the science of friction, wear and lubrication - the authors explore the practical applications of CMP and polishing across various market sectors. Due to the high pace of development of the electronics and semiconductors industry, many of the presented processes and applications come from these industries. Demystifies scientific developments and technological innovations, opening them up for new applications and process improvements in the semiconductor industry and other areas of precision engineering Explores stock removal mechanisms in CMP and polishing, and the challenges involved in predicting the outcomes of abrasive processes in high-precision environments The authors bring together the latest innovations and research from the USA and Japan

Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP
Author: Suryadevara Babu
Publsiher: Woodhead Publishing
Total Pages: 648
Release: 2021-09-24
ISBN 10: 0128218193
ISBN 13: 9780128218198
Language: EN, FR, DE, ES & NL

Advances in Chemical Mechanical Planarization CMP Book Review:

Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP

Advances in Chemical Mechanical Planarization CMP

Advances in Chemical Mechanical Planarization  CMP
Author: Suryadevara Babu
Publsiher: Woodhead Publishing
Total Pages: 536
Release: 2016-01-09
ISBN 10: 0081002181
ISBN 13: 9780081002186
Language: EN, FR, DE, ES & NL

Advances in Chemical Mechanical Planarization CMP Book Review:

Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Abrasive Technology

Abrasive Technology
Author: Anna Rudawska
Publsiher: BoD – Books on Demand
Total Pages: 212
Release: 2018-10-24
ISBN 10: 1789841933
ISBN 13: 9781789841930
Language: EN, FR, DE, ES & NL

Abrasive Technology Book Review:

The subject matter of this book is the information on the abrasive technology methods, the characteristics of the methods (for example, the technological parameters, tools, and machines), innovative methods, characteristics of surface structure and surface properties after this type of mechanical process, and application in various industrial branches and other technical and technological domains. Abrasive technology is very important, for example, in precision component manufacturing and nano-technology devices. The aim of this book is to present information on the characteristics and applications of abrasive technology, abrasive tools, tests, and also the innovative methods of this technology. This information enables scientists, engineers, and designers to ensure the soundness and integrity of the fabricated components and to develop new techniques effectively.

Advances in Chemical Mechanical Polishing Volume 816

Advances in Chemical Mechanical Polishing  Volume 816
Author: Materials Research Society. Meeting
Publsiher: Unknown
Total Pages: 292
Release: 2004-09
ISBN 10:
ISBN 13: UOM:39015059125883
Language: EN, FR, DE, ES & NL

Advances in Chemical Mechanical Polishing Volume 816 Book Review:

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.

Advances in Abrasive Technology XVIII

Advances in Abrasive Technology XVIII
Author: Hon Zong Choi,Hae Do Jeong,Xi Ping Xu,Hideki Aoyama
Publsiher: Trans Tech Publications Ltd
Total Pages: 718
Release: 2016-01-13
ISBN 10: 3035701326
ISBN 13: 9783035701326
Language: EN, FR, DE, ES & NL

Advances in Abrasive Technology XVIII Book Review:

Selected, peer reviewed papers from the 18th International Symposium on Advances in Abrasive Technology (ISAAT 2015), October 4-7, 2015, Juju Island, Korea

Advances in Chemical Mechanical Polishing

Advances in Chemical Mechanical Polishing
Author: Duane S. Boning,Johann W. Bartha,Ara Philipossian,Greg Shinn,Ingrid Vos
Publsiher: Cambridge University Press
Total Pages: 310
Release: 2014-06-05
ISBN 10: 9781107409194
ISBN 13: 1107409195
Language: EN, FR, DE, ES & NL

Advances in Chemical Mechanical Polishing Book Review:

While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. This book, first published in 2004, presents advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems - for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deep-trench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads and slurries are presented. Novel polishing methods and are described. Advances in CMP process understanding and modeling are also highlighted.

Chemical Mechanical Planarization of Semiconductor Materials

Chemical Mechanical Planarization of Semiconductor Materials
Author: M.R. Oliver
Publsiher: Springer Science & Business Media
Total Pages: 428
Release: 2004-01-26
ISBN 10: 9783540431817
ISBN 13: 3540431810
Language: EN, FR, DE, ES & NL

Chemical Mechanical Planarization of Semiconductor Materials Book Review:

This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Ultra Clean Processing of Semiconductor Surfaces XIII

Ultra Clean Processing of Semiconductor Surfaces XIII
Author: Paul W. Mertens,Marc Meuris,Marc Heyns
Publsiher: Trans Tech Publications Ltd
Total Pages: 414
Release: 2016-09-05
ISBN 10: 3035730849
ISBN 13: 9783035730845
Language: EN, FR, DE, ES & NL

Ultra Clean Processing of Semiconductor Surfaces XIII Book Review:

This volume contains the proceedings of 13th International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS 2016, Knokke, Belgium, September 12-14, 2016) (www.ucpss.org) and includes studies on cleaning such as particle removal using acoustic enhancement, removal of metallic contamination, pattern collapse of fine flexible and fragile features, wetting and drying issues, control and measuring of contamination . FEOL and BEOL topics cover: chemistry of semiconductor surfaces, cleaning related to new gate stacks, cleaning at the interconnect level, selective wet etching, resist strip and polymer removal, cleaning and contamination control for various new materials and cleaning after Chemical-Mechanical-Polishing (CMP).

Handbook of Semiconductor Manufacturing Technology

Handbook of Semiconductor Manufacturing Technology
Author: Yoshio Nishi,Robert Doering
Publsiher: CRC Press
Total Pages: 1720
Release: 2017-12-19
ISBN 10: 1351829823
ISBN 13: 9781351829823
Language: EN, FR, DE, ES & NL

Handbook of Semiconductor Manufacturing Technology Book Review:

Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Design for Advanced Manufacturing Technologies and Processes

Design for Advanced Manufacturing  Technologies and Processes
Author: LaRoux K. Gillespie
Publsiher: McGraw Hill Professional
Total Pages: 600
Release: 2017-05-12
ISBN 10: 1259587460
ISBN 13: 9781259587467
Language: EN, FR, DE, ES & NL

Design for Advanced Manufacturing Technologies and Processes Book Review:

Cutting-edge coverage of the new processes, materials, and technologies that are revolutionizing the manufacturing industry Expertly edited by a past president of the Society of Manufacturing Engineers, this state-of-the-art resource picks up where the bestselling Design for Manufacturability Handbook left off. Within its pages, readers will find detailed, clearly written coverage of the materials, technologies, and processes that have been developed and adopted in the manufacturing industry over the past sixteen years. More than this, the book also includes hard-to-find technical guidance and application information that can be used on the job to actually apply these cutting-edge processes and technologies in a real-world setting. Essential for manufacturing engineers and designers, Design for Advanced Manufacturing is enhanced by a host of international contributors, making the book a true global resource. • Information on the latest technologies and processes such as 3-D printing, nanotechnology, laser cutting, prototyping, additive manufacturing, and CAD/CAM software tools • Coverage of new materials including nano, smart, and shape-memory alloys, in steels, glass, plastics, and composites

Wafer Manufacturing

Wafer Manufacturing
Author: Imin Kao,Chunhui Chung
Publsiher: John Wiley & Sons
Total Pages: 304
Release: 2021-01-05
ISBN 10: 1118696239
ISBN 13: 9781118696231
Language: EN, FR, DE, ES & NL

Wafer Manufacturing Book Review:

Presenting all the major stages in wafer manufacturing, from crystals to prime wafers. This book first outlines the physics, associated metrology, process modelling and quality requirements and the goes on to discuss wafer forming and wafer surface preparation techniques. The whole is rounded off with a chapter on the research and future challenges in wafer manufacturing.

Microchip Fabrication

Microchip Fabrication
Author: Peter Van Zant
Publsiher: Unknown
Total Pages: 278
Release: 1984
ISBN 10:
ISBN 13: UOM:39015035728065
Language: EN, FR, DE, ES & NL

Microchip Fabrication Book Review:

Chemical Mechanical Polishing 2001 Advances and Future Challenges Volume 671

Chemical Mechanical Polishing 2001   Advances and Future Challenges  Volume 671
Author: Materials Research Society. Meeting
Publsiher: Unknown
Total Pages: 308
Release: 2001-12-14
ISBN 10:
ISBN 13: UCSD:31822031068034
Language: EN, FR, DE, ES & NL

Chemical Mechanical Polishing 2001 Advances and Future Challenges Volume 671 Book Review:

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This volume was first published in 2001.

Advances in Abrasive Technology

Advances in Abrasive Technology
Author: Anonim
Publsiher: Unknown
Total Pages: 329
Release: 2021
ISBN 10: 981449738X
ISBN 13: 9789814497381
Language: EN, FR, DE, ES & NL

Advances in Abrasive Technology Book Review:

Tribosystem Analysis

Tribosystem Analysis
Author: Peter J. Blau
Publsiher: CRC Press
Total Pages: 192
Release: 2017-12-19
ISBN 10: 1498700519
ISBN 13: 9781498700511
Language: EN, FR, DE, ES & NL

Tribosystem Analysis Book Review:

Tribosystem Analysis: A Practical Approach to the Diagnosis of Wear Problems provides a systematic framework for conducting root cause analyses and categorizing various types of wear. Designed specifically for engineers without formal training in tribology, this book: Describes a number of direct and indirect methods for detecting and quantifying wear problems Surveys different microscopy techniques, including those for light optics, electron optics, and acoustic imaging Discusses the selection of wear and friction test methods, both standard and custom, identifying possible pitfalls for misuse Presents practical examples involving complex materials and environments, such as those with variable loads and operating conditions Uses universally accepted terminology to create consistency along with the potential to recognize similar problems and apply comparable solutions Complete with checklists to ensure the right questions are asked during diagnosis, Tribosystem Analysis: A Practical Approach to the Diagnosis of Wear Problems offers pragmatic guidance for defining wear problems in the context of the materials and their surroundings.

Sulfur Acids Advances in Research and Application 2013 Edition

Sulfur Acids   Advances in Research and Application  2013 Edition
Author: Anonim
Publsiher: ScholarlyEditions
Total Pages: 623
Release: 2013-06-21
ISBN 10: 1481680501
ISBN 13: 9781481680509
Language: EN, FR, DE, ES & NL

Sulfur Acids Advances in Research and Application 2013 Edition Book Review:

Sulfur Acids—Advances in Research and Application: 2013 Edition is a ScholarlyEditions™ book that delivers timely, authoritative, and comprehensive information about Sulfinic Acids. The editors have built Sulfur Acids—Advances in Research and Application: 2013 Edition on the vast information databases of ScholarlyNews.™ You can expect the information about Sulfinic Acids in this book to be deeper than what you can access anywhere else, as well as consistently reliable, authoritative, informed, and relevant. The content of Sulfur Acids—Advances in Research and Application: 2013 Edition has been produced by the world’s leading scientists, engineers, analysts, research institutions, and companies. All of the content is from peer-reviewed sources, and all of it is written, assembled, and edited by the editors at ScholarlyEditions™ and available exclusively from us. You now have a source you can cite with authority, confidence, and credibility. More information is available at http://www.ScholarlyEditions.com/.

Ultra wide Bandgap Semiconductor Materials

Ultra wide Bandgap Semiconductor Materials
Author: Meiyong Liao,Bo Shen,Zhanguo Wang
Publsiher: Elsevier
Total Pages: 503
Release: 2019-06-18
ISBN 10: 0128172568
ISBN 13: 9780128172568
Language: EN, FR, DE, ES & NL

Ultra wide Bandgap Semiconductor Materials Book Review:

Ultra-wide Bandgap Semiconductors (UWBG) covers the most recent progress in UWBG materials, including sections on high-Al-content AlGaN, diamond, B-Ga2O3, and boron nitrides. The coverage of these materials is comprehensive, addressing materials growth, physics properties, doping, device design, fabrication and performance. The most relevant and important applications are covered, including power electronics, RF electronics and DUV optoelectronics. There is also a chapter on novel structures based on UWBG, such as the heterojunctions, the low-dimensional structures, and their devices. This book is ideal for materials scientists and engineers in academia and R&D searching for materials superior to silicon carbide and gallium nitride. Provides a one-stop resource on the most promising ultra-wide bandgap semiconducting materials, including high-Al-content AlGaN, diamond, β-Ga2O3, boron nitrides, and low-dimensional materials Presents comprehensive coverage, from materials growth and properties, to device design, fabrication and performance Features the most relevant applications, including power electronics, RF electronics and DUV optoelectronics

Modern Machining Technology

Modern Machining Technology
Author: Bijoy Bhattacharyya,Biswanath Doloi
Publsiher: Academic Press
Total Pages: 780
Release: 2019-09-17
ISBN 10: 012812895X
ISBN 13: 9780128128954
Language: EN, FR, DE, ES & NL

Modern Machining Technology Book Review:

Modern Machining Technology: Advanced, Hybrid, Micro Machining and Super Finishing Technology explores complex and precise components with challenging shapes that are increasing in demand in industry. As the first book to cover all major technologies in this field, readers will find the latest technical developments and research in one place, allowing for easy comparison of specifications. Technologies covered include mechanical, thermal, chemical, micro and hybrid machining processes, as well as the latest advanced finishing technologies. Each topic is accompanied by a basic overview, examples of typical applications and studies of performance criteria. In addition, readers will find comparative advantages, model questions and solutions. Addresses a broad range of modern machining techniques, providing specifications for easy comparison Includes descriptions of the main applications for each method, along with the materials or products needed Provides the very latest research in processes, including hybrid machining

Advances in Materials Manufacturing Science and Technology

Advances in Materials Manufacturing Science and Technology
Author: Xing Ai,Jian Feng Li,Chuanzhen Huang
Publsiher: Trans Tech Publications Ltd
Total Pages: 930
Release: 2004-12-15
ISBN 10: 3035706409
ISBN 13: 9783035706406
Language: EN, FR, DE, ES & NL

Advances in Materials Manufacturing Science and Technology Book Review:

This collection comprises a selection of over 180 papers; submitted to the editors by numerous universities and industrial concerns, and subjected to peer-review by at least two expert referees. Volume is indexed by Thomson Reuters CPCI-S (WoS). The papers were selected on the basis of their quality, and their combined coverage of the main topics of the book.