Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
Author: James J. Licari,Dale W. Swanson
Publsiher: William Andrew
Total Pages: 512
Release: 2011-06-24
ISBN 10: 9781437778908
ISBN 13: 1437778909
Language: EN, FR, DE, ES & NL

Adhesives Technology for Electronic Applications Book Review:

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: • Tamper-proof adhesives for electronic security devices. • Bio-compatible adhesives for implantable medical devices. • Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly – as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). • Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications – this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals Provides specifications of adhesives for particular uses and outlines the processes for application and curing – coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel

Adhesives Technology for Electronic Applications

Adhesives Technology for Electronic Applications
Author: James J. Licari,Dale W. Swanson
Publsiher: William Andrew
Total Pages: 414
Release: 2016-07-14
ISBN 10: 9780128103708
ISBN 13: 0128103701
Language: EN, FR, DE, ES & NL

Adhesives Technology for Electronic Applications Book Review:

Adhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups. The book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts and the regulatory framework make this book particularly important for engineers and managers alike. The third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly green adhesives. Information about regulations and compliance has been brought fully up-to-date. As well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as: Tamper-proof adhesives for electronic security devices. Bio-compatible adhesives for implantable medical devices. Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly as required by regulatory regimes, e.g. the EU s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market). Nano-fillers in adhesives, used to increase the thermal conductivity of current adhesives for cooling electronic devices. A complete guide for the electronics industry to adhesive types, their properties and applications this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists and other engineering professionals. Provides specifications of adhesives for particular uses and outlines the processes for application and curing coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device. Discusses the respective advantages and limitations of different adhesives for a varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel. "

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Haleh Ardebili,Jiawei Zhang,Michael Pecht
Publsiher: William Andrew
Total Pages: 508
Release: 2018-10-23
ISBN 10: 0128119799
ISBN 13: 9780128119792
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Advanced Adhesives in Electronics

Advanced Adhesives in Electronics
Author: M O Alam,C Bailey
Publsiher: Elsevier
Total Pages: 280
Release: 2011-05-25
ISBN 10: 0857092898
ISBN 13: 9780857092892
Language: EN, FR, DE, ES & NL

Advanced Adhesives in Electronics Book Review:

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. Advanced adhesives in electronics reviews recent developments in adhesive joining technology, processing and properties. The book opens with an introduction to adhesive joining technology for electronics. Part one goes on to cover different types of adhesive used in electronic systems, including thermally conductive adhesives, isotropic and anisotropic conductive adhesives and underfill adhesives for flip-chip applications. Part two focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces, modelling techniques used to assess adhesive properties and adhesive technology for photonics. With its distinguished editors and international team of contributors, Advanced adhesives in electronics is a standard reference for materials scientists, engineers and chemists using adhesives in electronics, as well as those with an academic research interest in the field. Reviews recent developments in adhesive joining technology, processing and properties featuring flip-chip applications Provides a comprehensive overview of adhesive joining technology for electronics including different types of adhesives used in electronic systems Focuses on the properties and processing of electronic adhesives, with chapters covering the structural integrity of metal-polymer adhesive interfaces and modelling techniques

Adhesives Technology Handbook

Adhesives Technology Handbook
Author: Arthur H. Landrock,Sina Ebnesajjad
Publsiher: William Andrew
Total Pages: 475
Release: 2008-09-16
ISBN 10: 0815516010
ISBN 13: 9780815516019
Language: EN, FR, DE, ES & NL

Adhesives Technology Handbook Book Review:

Following the successful first, the second edition is a complete guide to all that is required to successfully bond materials. It is both a reference and a source for learning the basics for those involved in the entire product value chains. Basic principles of adhesion such as surface characterization, types of adhesive bonds, and adhesion failure topics are covered in addition to a description of common adhesive materials and application techniques. Provides the end user practitioners of adhesion technology with a complete guide to bonding materials successfully Covers most substrates, including plastics, metals, elastomers and ceramics, explaining basic principles and describing common materials and application techniques Arranges information so that each chapter can be studied selectively or in conjunction with others

Adhesive Bonding

Adhesive Bonding
Author: Robert D. Adams
Publsiher: Woodhead Publishing
Total Pages: 826
Release: 2021-07-02
ISBN 10: 0323851436
ISBN 13: 9780323851435
Language: EN, FR, DE, ES & NL

Adhesive Bonding Book Review:

Adhesive Bonding: Science, Technology and Applications, Second Edition guides the reader through the fundamentals, mechanical properties and applications of adhesive bonding. This thoroughly revised and expanded new edition reflects the many advances that have occurred in recent years. Sections cover the fundamentals of adhesive bonding, explaining how adhesives and sealants work, and how to assess and treat surfaces, how adhesives perform under stress and the factors affecting fatigue and failure, stress analysis, environmental durability, non-destructive testing, impact behavior, fracture mechanics, fatigue, vibration damping, and applications in construction, automotive, marine, footwear, electrical engineering, aerospace, repair, electronics, biomedicine, and bonding of composites. With its distinguished editor and international team of contributors, this book is an essential resource for industrial engineers, R&D, and scientists working with adhesives and their industrial applications, as well as researchers and advanced students in adhesion, joining, polymer science, materials science and mechanical engineering. Offers detailed, methodical coverage of the fundamentals, mechanical properties and industrial applications of adhesive bonding Enables the successful preparation of adhesives for a broad range of important load-bearing applications in areas such as automotive and aerospace, construction, electronics and biomedicine Covers the latest advances in adhesive bonding, including improved repair techniques for metallic and composite structures, cohesive zone modeling, and disassembly and recycling

Applied Adhesive Bonding in Science and Technology

Applied Adhesive Bonding in Science and Technology
Author: Halil Ozer
Publsiher: BoD – Books on Demand
Total Pages: 144
Release: 2018-02-21
ISBN 10: 9535138391
ISBN 13: 9789535138396
Language: EN, FR, DE, ES & NL

Applied Adhesive Bonding in Science and Technology Book Review:

This book brings together scientists and provides the reader with a comprehensive overview of some recent developments in the field of adhesive bonding with the contributions of internationally recognized authors. This book is divided into three sections: "Structural Adhesive Bonding," "Wood Adhesive Bonding," and "Adhesive Bonding in Medical Applications." Each section presents an important review and some applications of the adhesive bonding in various different disciplines. I hope that the book published in open access will help researchers to benefit from it.

Electrical Conductive Adhesives with Nanotechnologies

Electrical Conductive Adhesives with Nanotechnologies
Author: Yi (Grace) Li,Daniel Lu,C.P. Wong
Publsiher: Springer Science & Business Media
Total Pages: 437
Release: 2009-10-08
ISBN 10: 9780387887838
ISBN 13: 0387887830
Language: EN, FR, DE, ES & NL

Electrical Conductive Adhesives with Nanotechnologies Book Review:

“Electrical Conductive Adhesives with Nanotechnologies” begins with an overview of electronic packaging and discusses the various adhesives options currently available, including lead-free solder and ECAs (Electrically Conductive Adhesives). The material presented focuses on the three ECA categories specifically, Isotropically Conductive Adhesives (ICAs) Anisotropically Conductive Adhesives/Films (ACA/ACF) and Nonconductive Adhesives/Films (NCA/NCF). Discussing the advantages and limitations of each technique, and how each technique is currently applied. Lastly, a detailed presentation of how nano techniques can be applied to conductive adhesives is discussed, including recent research and development of nano component adhesives/nano component films, their electrical properties, thermal performance, bonding pressure and assembly and reliability.

Bio based Wood Adhesives

Bio based Wood Adhesives
Author: Zhongqi He
Publsiher: CRC Press
Total Pages: 366
Release: 2017-05-25
ISBN 10: 1315352257
ISBN 13: 9781315352251
Language: EN, FR, DE, ES & NL

Bio based Wood Adhesives Book Review:

Adhesive bonding plays an increasing role in the forest product industry and is a key factor for efficiently utilizing timber and other lignocellulosic resources. As synthetic wood adhesives are mostly derived from depleting petrochemical resources and have caused increasing environmental concern, natural product and byproduct-derived adhesives have attracted much attention in the last decades. Although adhesives made from plant and animal sources have been in existence since ancient times, increased knowledge of their chemistry and improved technical formulation of their preparation are still needed to promote their broader industrial applications. The primary goals of this book are to (1) synthesize the fundamental knowledge and latest research on bio-based adhesives from a remarkable range of natural products and byproducts, (2) identify need areas and provide directions of future bio-based adhesive research, and (3) help integrating research findings in practical adhesive application for maximal benefits. This book covers information on a variety of natural products and byproducts and the latest research on formulation, testing and improvement of the relevant adhesives in fifteen chapters written by an international group of accomplished contributors. This book will serve as a valuable reference source for university faculty, graduate students, research scientists, agricultural and wood engineers, international organization advocators and government agency regulators who work and deal with enhanced utilization of agricultural and forest products and byproducts.

Nanomaterials for Spectroscopic Applications

Nanomaterials for Spectroscopic Applications
Author: Kaushik Pal
Publsiher: CRC Press
Total Pages: 358
Release: 2021-06-18
ISBN 10: 1000368270
ISBN 13: 9781000368277
Language: EN, FR, DE, ES & NL

Nanomaterials for Spectroscopic Applications Book Review:

This book provides an overview of key current developments in the synthetic strategy of functional novel nanomaterials in various spectroscopic characterizations and evaluations and highlights possible future applications in nanotechnology and materials science. It illustrates the wide-ranging interest in these areas and provides a background to the later chapters, which address the novel synthesis of high-yield nanomaterials and their biomaterials, graphene, polymeric nanomaterials, green nanomaterials, green polyester, liquid crystal electro-optic switching applications, nanobiotechnology, transition metal oxides, response characteristics of exclusive spectroscopic investigation as well as electron microscopic study, flexible and transparent electrodes, optoelectronics, nanoelectronics, smart displays, switchable device modulation, health care, energy storage, solar/fuel cells, environmental and plant biology, social, ethical, and regulatory implications of various aspects of green nanotechnology, as well as significant foreseeable spectroscopic applications of key functional nanomaterials. Given appropriate regulation for and research on the topics covered, commercial production of manufactured novel composite materials can be realized. Furthermore, the many discoveries highlighted in the book can modulate spectroscopic performances with technical excellence in multidisciplinary research of high competence.

Electrically Conductive Adhesives

Electrically Conductive Adhesives
Author: Rajesh Gomatam,Kash L. Mittal
Publsiher: CRC Press
Total Pages: 426
Release: 2008-12-23
ISBN 10: 9004187820
ISBN 13: 9789004187825
Language: EN, FR, DE, ES & NL

Electrically Conductive Adhesives Book Review:

With all the environmental concerns and constraints today and stricter future regulations, there is a patent need to replace materials noxious to the environment by environmentally-friendly alternatives. Electrically conductive adhesives (ECAs) are one such example. ECAs offer an excellent alternative to lead-solder interconnects for microelectronic packaging applications. ECAs are used in electronics for laptop computers, camcorders, watch electronics, hard-drive suspensions and a myriad of electronic equipments. Environmentally-friendly ECAs offer many advantages vis-à-vis solder, such as simple and low-temperature processing conditions, better thermo mechanical performance and finer pitch. This book is based on the two Special Issues of the Journal of Adhesion Science and Technology (JAST vol. 22, no. 8-9 and vol. 22, no. 14) dedicated to this topic. The book contains a total of 21 papers (reflecting overviews and original research) and is divided into three parts as follows: Part 1: Introduction and Recent Developments, Part 2: Mechanical, Durability and Reliability Aspects and Part 3: Characterization and Properties.

Wireless Medical Systems and Algorithms

Wireless Medical Systems and Algorithms
Author: Pietro Salvo,Miguel Hernandez-Silveira
Publsiher: CRC Press
Total Pages: 284
Release: 2017-11-22
ISBN 10: 1498700780
ISBN 13: 9781498700788
Language: EN, FR, DE, ES & NL

Wireless Medical Systems and Algorithms Book Review:

Wireless Medical Systems and Algorithms: Design and Applications provides a state-of-the-art overview of the key steps in the development of wireless medical systems, from biochips to brain–computer interfaces and beyond. The book also examines some of the most advanced algorithms and data processing in the field. Addressing the latest challenges and solutions related to the medical needs, electronic design, advanced materials chemistry, wireless body sensor networks, and technologies suitable for wireless medical devices, the text: Investigates the technological and manufacturing issues associated with the development of wireless medical devices Introduces the techniques and strategies that can optimize the performances of algorithms for medical applications and provide robust results in terms of data reliability Includes a variety of practical examples and case studies relevant to engineers, medical doctors, chemists, and biologists Wireless Medical Systems and Algorithms: Design and Applications not only highlights new technologies for the continuous surveillance of patient health conditions, but also shows how disciplines such as chemistry, biology, engineering, and medicine are merging to produce a new class of smart devices capable of managing and monitoring a wide range of cognitive and physical disabilities.

Advanced Adhesives in Electronics Materials Properties and Applications

Advanced Adhesives in Electronics  Materials  Properties and Applications
Author: M. O. Alam,C. Bailey
Publsiher: Woodhead Publishing
Total Pages: 280
Release: 2011-06
ISBN 10: 9780081017326
ISBN 13: 0081017324
Language: EN, FR, DE, ES & NL

Advanced Adhesives in Electronics Materials Properties and Applications Book Review:

Adhesives for electronic applications serve important functional and structural purposes in electronic components and packaging, and have developed significantly over the last few decades. This book reviews recent developments in adhesive joining technology, processing and properties.

Advanced Green Materials

Advanced Green Materials
Author: Shakeel Ahmed
Publsiher: Woodhead Publishing
Total Pages: 494
Release: 2020-11-24
ISBN 10: 0128226757
ISBN 13: 9780128226759
Language: EN, FR, DE, ES & NL

Advanced Green Materials Book Review:

Advanced Green Materials: Fabrication, Characterization and Applications of Biopolymers and Biocomposites looks at their extraction, purification, modification, and processing for various industrial, biomedical, pharmaceutical, and construction applications. The book comprehensively summarizes recent technical research accomplishments in natural materials and discusses various aspects of natural materials from a chemistry/engineering point of view. The book is unique with contributions from experts working on hybrid biopolymers and bio- composites, bioactive and biodegradable materials, bio-inert polymers and composites, natural polymer and composites, and metallic natural materials. The book will be a useful reference for scientists, academicians, research scholars, and biotechnologists. Advanced biocomposite materials continue to become increasingly popular and important for a broad range of different science and engineering applications. In the race to exploit the unique mechanical, thermal, and electrical properties of these materials, researchers must also address new challenges to predict, understand, and manage the potentially adverse effects they could have on the environment and human lives. The book describes recent developments and applications of biopolymers and biocomposites for applications in various industrial fields. Chapters include original research and the latest reviews in similar fields. Biopolymers and biocomposites occupy an exceptional position in the exciting new world of novel biomaterials. Considering their sustainability, non-toxic properties, and their ability to have tailored properties and functions, they should be considered as a smart candidate in the advancement of biomaterials technology. Covers all types of biopolymers and advanced industrial applications, from packaging to biomedical therapeutics Discusses the shift from research to industrial large-scale application of biopolymers and biocomposites Emphasizes new strategic trends, such as bio-based and biodegradable additives for bioplastics, PHAs, new lignin-based biopolymers, and new polymers based on terpenes and biosensor applications

Adhesion and Adhesives Technology

Adhesion and Adhesives Technology
Author: Alphonsus V. Pocius
Publsiher: Hanser Gardner Publications
Total Pages: 319
Release: 2002
ISBN 10: 9781569903193
ISBN 13: 1569903190
Language: EN, FR, DE, ES & NL

Adhesion and Adhesives Technology Book Review:

This book describes, in clear, understandable language, the three main disciplines of adhesion technology:

Handbook of Industrial Chemistry and Biotechnology

Handbook of Industrial Chemistry and Biotechnology
Author: James A. Kent
Publsiher: Springer Science & Business Media
Total Pages: 1562
Release: 2013-01-13
ISBN 10: 1461442591
ISBN 13: 9781461442592
Language: EN, FR, DE, ES & NL

Handbook of Industrial Chemistry and Biotechnology Book Review:

Substantially revising and updating the classic reference in the field, this handbook offers a valuable overview and myriad details on current chemical processes, products, and practices. No other source offers as much data on the chemistry, engineering, economics, and infrastructure of the industry. The Handbook serves a spectrum of individuals, from those who are directly involved in the chemical industry to others in related industries and activities. It provides not only the underlying science and technology for important industry sectors, but also broad coverage of critical supporting topics. Industrial processes and products can be much enhanced through observing the tenets and applying the methodologies found in chapters on Green Engineering and Chemistry (specifically, biomass conversion), Practical Catalysis, and Environmental Measurements; as well as expanded treatment of Safety, chemistry plant security, and Emergency Preparedness. Understanding these factors allows them to be part of the total process and helps achieve optimum results in, for example, process development, review, and modification. Important topics in the energy field, namely nuclear, coal, natural gas, and petroleum, are covered in individual chapters. Other new chapters include energy conversion, energy storage, emerging nanoscience and technology. Updated sections include more material on biomass conversion, as well as three chapters covering biotechnology topics, namely, Industrial Biotechnology, Industrial Enzymes, and Industrial Production of Therapeutic Proteins.

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Haleh Ardebili,Michael Pecht
Publsiher: William Andrew
Total Pages: 504
Release: 2009-07-22
ISBN 10: 9780815519706
ISBN 13: 0815519702
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology. Guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Coverage of environmentally friendly 'green encapsulants' Practical coverage of faults and defects: how to analyze them and how to avoid them

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications
Author: Jiawei Zhang,Haleh Ardebili,Michael Pecht
Publsiher: Mosby Limited
Total Pages: 550
Release: 2018-05
ISBN 10: 9780128119785
ISBN 13: 0128119780
Language: EN, FR, DE, ES & NL

Encapsulation Technologies for Electronic Applications Book Review:

Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic. Provides guidance on the selection and use of encapsulants in the electronics industry, with a particular focus on microelectronics Includes coverage of environmentally friendly 'green encapsulants' Presents coverage of faults and defects, and how to analyze and avoid them

Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging

Micro  and Opto Electronic Materials and Structures  Physics  Mechanics  Design  Reliability  Packaging
Author: Ephraim Suhir,Y.C. Lee,C.P. Wong
Publsiher: Springer Science & Business Media
Total Pages: 1460
Release: 2007-05-26
ISBN 10: 0387329897
ISBN 13: 9780387329895
Language: EN, FR, DE, ES & NL

Micro and Opto Electronic Materials and Structures Physics Mechanics Design Reliability Packaging Book Review:

This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Adhesives

Adhesives
Author: Anna Rudawska
Publsiher: BoD – Books on Demand
Total Pages: 398
Release: 2016-11-23
ISBN 10: 9535127837
ISBN 13: 9789535127833
Language: EN, FR, DE, ES & NL

Adhesives Book Review:

This book presents some information regarding adhesives which have applications in industry, medicine and dentistry. The book is divided into two parts: "Adhesives Applications in Medicine and Dentistry" and "Properties of Adhesive." The aim of such a presentation is to present the usage in very different aspects of application of the adhesives and present specific properties of adhesives. Adhesives' advantageous properties and relatively uncomplicated processing methods contribute to their increasing application and their growing popularity in the industry, medicine and other branches. Some adhesives represent properties superior to those of most adhesive materials, due to their excellent adhesion and chemical resistance. A wide variety of adhesives' considerable flexibility in modification of properties of adhesives allows adjusting the composition to particular applications.